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PDF NCP2990 Data sheet ( Hoja de datos )
| Número de pieza | NCP2990 | |
| Descripción | Audio Power Amplifier | |
| Fabricantes | ON Semiconductor | |
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NCP2990
1.3 Watt Audio Power
Amplifier with Fast Turn On
Time
The NCP2990 is an audio power amplifier designed for portable
communication device applications such as mobile phone
applications. The NCP2990 is capable of delivering 1.3 W of
continuous average power to an 8.0 W BTL load from a 5.0 V power
supply, and 1.0 W to a 4.0 W BTL load from a 3.6 V power supply.
The NCP2990 provides high quality audio while requiring few
external components and minimal power consumption. It features a
low−power consumption shutdown mode, which is achieved by
driving the SHUTDOWN pin with logic low.
The NCP2990 contains circuitry to prevent from “pop and click”
noise that would otherwise occur during turn−on and turn−off
transitions. It is a zero pop noise device when a single ended audio
input is used.
For maximum flexibility, the NCP2990 provides an externally
controlled gain (with resistors), as well as an externally controlled
turn−on time (with the bypass capacitor). When using a 1 mF bypass
capacitor, it offers 60 ms wake up time.
Due to its superior PSRR, it can be directly connected to the
battery, saving the use of an LDO.
This device is available in a 9−Pin Flip−Chip CSP (Lead−Free).
Features
• 1.3 W to an 8.0 W BTL Load from a 5.0 V Power Supply
• Superior PSRR: Direct Connection to the Battery
• Zero Pop Noise Signature with a Single Ended Audio Input
• Ultra Low Current Shutdown Mode: 10 nA
• 2.2 V−5.5 V Operation
• External Gain Configuration Capability
• External Turn−on Time Configuration Capability:
60 ms (1 mF Bypass Capacitor)
• Up to 1.0 nF Capacitive Load Driving Capability
• Thermal Overload Protection Circuitry
• This is a Pb−Free Device*
Typical Applications
• Portable Electronic Devices
• PDAs
• Wireless Phones
http://onsemi.com
MARKING
DIAGRAMS
9−Pin Flip−Chip CSP
FC SUFFIX
1 CASE 499E
A3
MBAG
AYWW
A1
C1
MBA
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
9−Pin Flip−Chip CSP
A1 A2
INM OUTA
B1
VM_P
C1
B2
VM
C2
A3
INP
B3
Vp
C3
BYPASS OUTB SHUTDOWN
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
September, 2006 − Rev. 0
DataSheet4 U .com
1
Publication Order Number:
NCP2990/D
1 page  
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10
VP = 2.5 V
RL = 8 W
f = 1 kHz
1
NCP2990
TYPICAL PERFORMANCE CHARACTERISTICS
10
VP = 3.0 V
RL = 8 W
f = 1 kHz
1
0.1 0.1
0.01
0
50 100 150 200 250 300
POUT (mW)
Figure 2. THD+N versus Output Power
350
0.01
0
100 200 300 400 500
POUT (mW)
Figure 3. THD+N versus Output Power
10
VP = 3.6 V
RL = 8 W
f = 1 kHz
1
10
VP = 4.2 V
RL = 8 W
f = 1 kHz
1
0.1 0.1
0.01
0
100 200 300 400 500 600 700
POUT (mW)
Figure 4. THD+N versus Output Power
800
0.01
0
200 400 600 800 1000
POUT (mW)
Figure 5. THD+N versus Output Power
10
VP = 5.0 V
RL = 8 W
f = 1 kHz
1
10
VP = 2.5 V
RL = 4 W
f = 1 kHz
1
0.1 0.1
0.01
0
200 400 600 800 1000 1200 1400 1600
POUT (mW)
Figure 6. THD+N versus Output Power
0.01
0
100 200 300 400 500
POUT (mW)
Figure 7. THD+N versus Output Power
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http://onsemi.com
5
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NCP2990
Figure 26. Demonstration Board for 9−Pin Flip−Chip CSP Device − Silkscreen Layers
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http://onsemi.com
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| PDF Descargar | [ Datasheet NCP2990.PDF ] | |
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