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Numéro de référence | CDR01xxxxxx | ||
Description | Ceramic Chip | ||
Fabricant | Kemet Electronics | ||
Logo | |||
www.DataSheet4U.com
CERAMIC CHIP/MIL-PRF-55681
CAPACITOR OUTLINE DRAWINGS
CHIP DIMENSIONS
“SOLDERGUARD I” *
“SOLDERGUARD II”
WL
SOLDER
TINNED
T BW
NICKEL
NICKEL
ELECTRODES
SILVER
METALLIZATION
Military Designation - “S” or “U”
KEMET Designation - “H”
ELECTRODES
SILVER
METALLIZATION
Military Designation - “W” or “Y”
KEMET Designation - “C”
DIMENSIONS—MILLIMETERS AND (INCHES)
STYLE
KEMET
SIZE
CODE
L
T
W MIN. MAX.
BW
CDR01
CDR02
CDR03
CDR04
CDR05
CDR06
CDR31
CDR32
CDR33
CDR34
CDR35
C0805
C1805
C1808
C1812
C1825
C2225
C0805
C1206
C1210
C1812
C1825
2.03 ±.38 (.080 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
( )+.51
4.57
+.020
.180
–.38 –.015
5.72 ±.51 (.225 ±.020)
2.00 ±.20 (.078 ±.008)
3.20 ±.20 (.125 ±.008)
3.20 ±.25 (.125 ±.010)
4.50 ±.25 (.176 ±.010)
4.50 ±.30 (.176 ±.012)
1.27 ±.38 (.050 ±.015)
1.27 ±.38 (.050 ±.015)
2.03 ±.38 (.080 ±.015)
3.18 ±.38 (.125 ±.015)
( )+.51
6.35
+.020
.250
–.38 –.015
6.35 ±.51 (.250 ±.020)
1.25 ±.20 (.049 ±.008)
1.60 ±.20 (.062 ±.008)
2.50 ±.25 (.098 ±.010)
3.20 ±.25 (.125 ±.010)
6.40 ±.30 (.250 ±.012)
.56 (.022)
.56 (.022)
.56 (.022)
.56 (.022)
.51 (.020)
.51 (.020)
1.40 (.055)
1.40 (.055)
2.03 (.080)
2.03 (.080)
2.03 (.080)
2.03 (.080)
1.30 (.051)
1.30 (.051)
1.50 (.059)
1.50 (.059)
1.50 (.059)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.30 (.020 ±.012)
Note: For Solderguard I (MIL-C55681 “S” or “U” Endmets), the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following
amounts:
Length
Width/Thickness
CDR01
0.51MM (.020) 0.38MM (.015)
CDR02-06
0.64MM (.025) 0.38MM (.015)
CDR31-35
0.60MM (.023) 0.30MM (.012)
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01 B P 101 B K S M
STYLE & SIZE CODE
STYLE
C — Ceramic
D — Dielectric, Fixed Chip
R — Established Reliability
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE
X —± 15%—without voltage
+ 15%, –25%—with voltage
CAPACITANCE
Expressed in picofarads (pF).
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
FAILURE RATE LEVEL (%/1000 hrs.)
M — 1.0 R — 0.01
P — 0.1 S — 0.001
TERMINATION FINISH
S — Solder Coated, Final
(SolderGuard I)
U — Base Metalization—
Barrier Metal—Solder
Coated (SolderGuard I)
W — Base Metalization—
Barrier Metal—Tinned
Tin or (Tin/Lead Alloy)
SolderGuard II
Y — Base Metalization
Barrier Metal—Tinned
(100% Tin) Solderguard II
CAPACITANCE TOLERANCE
B C DFJ KM
±.1 pF ±.25 pF ±.5 pF ±1% ±5% ±10% ±20%
RATED VOLTAGE
A — 50; B — 100
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805 P 101 K 1 G M C*
CERAMIC
SIZE CODE
See Table Above
SPECIFICATION
P -MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
CAPACITANCE CODE
Expressed in picofarads (pF).
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9 pF. Example: 2.2 pF –229)
CAPACITANCE TOLERANCE
B C DF J KM
±.1 pF ±.25 pF ±.5 pF ±1% ±5% ±10% ±20%
END METALIZATION
C — SolderGuard II (Military equiv: Y, W)
H — SolderGuard I (Military equiv: S, U)
FAILURE RATE (%/1,000 hrs.)
M — 1.0 R — 0.01
P — 0.1 S — 0.001
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G — BP (C0G/NP0) (±30 PPM/°C)
X — BX (±15% Without Voltage
+15% -25% With Voltage)
VOLTAGE
1 — 100V, 5 — 50V
* Part Number Example: C0805P101K1GMC (14 digits - no spaces)
72 KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
DataSheet4 U .com
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Pages | Pages 6 | ||
Télécharger | [ CDR01xxxxxx ] |
No | Description détaillée | Fabricant |
CDR01xxxxxx | Ceramic Chip | Metuchen Capacitors |
CDR01xxxxxx | Ceramic Chip | Kemet Electronics |
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