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PDF IRHF7330SE Data sheet ( Hoja de datos )
| Número de pieza | IRHF7330SE | |
| Descripción | RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-205AF) | |
| Fabricantes | International Rectifier | |
| Logotipo |  |
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RADIATION HARDENED
POWER MOSFET
THRU-HOLE (TO-205AF)
PD-91864B
IRHF7330SE
JANSR2N7463T2
400V, N-CHANNEL
REF: MIL-PRF-19500/675
RAD Hard™ HEXFET® TECHNOLOGY
Product Summary
Part Number
Radiation Level
IRHF7330SE 100K Rads (Si)
RDS(on) ID QPL Part Number
1.39Ω 2.9A JANSR2N7463T2
International Rectifier’s RADHardTM HEXFET® MOSFET
technology provides high performance power MOSFETs
for space applications. This technology has over a de-
cade of proven performance and reliability in satellite
applications. These devices have been characterized
for both Total Dose and Single Event Effects (SEE). The
combination of low RDS(on) and low gate charge reduces
the power losses in switching applications such as DC to
DC converters and motor control. These devices retain
all of the well established advantages of MOSFETs such
as voltage control, fast switching, ease of paralleling and
temperature stability of electrical parameters.
TO-205AF
Features:
n Single Event Effect (SEE) Hardened
n Ultra Low RDS(on)
n Low Total Gate Charge
n Proton Tolerant
n Simple Drive Requirements
n Ease of Paralleling
n Hermetically Sealed
n Light Weight
Absolute Maximum Ratings
Pre-Irradiation
Parameter
Units
ID @ VGS = 12V, TC = 25°C
ID @ VGS = 12V, TC = 100°C
IDM
PD @ TC = 25°C
Continuous Drain Current
Continuous Drain Current
Pulsed Drain Current ➀
Max. Power Dissipation
Linear Derating Factor
2.9
1.8
11.6
25
0.2
A
W
W/°C
VGS
EAS
IAR
EAR
dv/dt
TJ
TSTG
Gate-to-Source Voltage
Single Pulse Avalanche Energy ➁
Avalanche Current ➀
Repetitive Avalanche Energy ➀
Peak Diode Recovery dv/dt ➂
Operating Junction
Storage Temperature Range
±20
144
2.9
2.5
6.7
-55 to 150
V
mJ
A
mJ
V/ns
oC
Lead Temperature
Weight
300 (0.063 in. (1.6mm) from case for 10 sec.)
0.98 (Typical)
g
For footnotes refer to the last page
www.irf.com
1
02/07/03
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1 page  
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Pre-Irradiation
IRHF7330SE
1200
1000
800
600
400
200
VGS = 0V, f = 1MHz
Ciss = Cgs + Cgd , Cds SHORTED
Crss = Cgd
Coss = Cds + Cgd
Ciss
Coss
Crss
0
1 10 100
VDS , Drain-to-Source Voltage (V)
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
20 ID = 23.A9A
16
VDS = 320V
VDS = 200V
VDS = 80V
12
8
4
FOR TEST CIRCUIT
SEE FIGURE 13
0
0 8 16 24 32 40
QG , Total Gate Charge (nC)
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
100
TJ = 150° C
10
1 TJ = 25 ° C
0.1
0.0
VGS = 0 V
0.4 0.8 1.2 1.6 2.0
VSD ,Source-to-Drain Voltage (V)
Fig 7. Typical Source-Drain Diode
Forward Voltage
www.irf.com
100
OPERATION IN THIS AREA LIMITED
BY RDS(on)
10 10us
100us
1 1ms
TC = 25 °C
TJ = 150 °C
Single Pulse
0.1
1 10
10ms
100 1000
VDS , Drain-to-Source Voltage (V)
Fig 8. Maximum Safe Operating Area
5
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| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet IRHF7330SE.PDF ] | |
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