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PDF M68HC705E6PGMR Data sheet ( Hoja de datos )
| Número de pieza | M68HC705E6PGMR | |
| Descripción | M68HC705E6PGMR Users Manual | |
| Fabricantes | Freescale Semiconductor | |
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PROGRAMMING MFOrDeUeLsEcPaRlEePASReAmTiIOcoNnductor, Inc.
The PGMR must be prepared/configured prior to any program/verify operations.
Board preparation consists of the external power source (+5V and V PP), EPROM
installation, DIP, SOIC, or QFP PGMR configuration.
External Power Source
Power connector P1 is used to connect an external power supply to the PGMR. A +5
Vdc @ 100 mA power source is connected to connector P1 pins labeled +5V and GND.
The programming voltage power source is connected to pins labeled VPP and GND.
Refer to the specific device data sheet for programming voltage (VPP) specifications.
NOTE
The programming voltage (VPP) must be measured at SKT2
pin 1 during programming cycle (D3) PROGRAM LED
illuminated.
EPROM Installation
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The basic EPROM device used on the PGMR (at location SKT1) is a 27256 or 27C256, 32K
EPROM, 28-pin device. This EPROM device contains the user code to be programmed
into the applicable PROM MCU device.
DIP PGMR Configuration
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For the dual-in-line package (DIP) device programming, the PGMR printed wiring
board (PWB) must be fabricated with a DIP zero-insertion-force (ZIF) socket located at
SKT2.
SOIC PGMR Configuration
For the small chip carrier (SOIC) device programming, the PGMR printed wiring board
(PWB) must be fabricated with a SOIC zero-insertion-force (ZIF) socket located at SKT3.
QFP PGMR Configuration
For quad flat pack (QFP) MCU device programming, the PGMR PWB must be fabricated
with QFP ZIF sockets located at SKT 4.
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USER
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MOTOROLA
HC705E6PGMR/D2
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet M68HC705E6PGMR.PDF ] | |
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