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PDF NTZD3154N Data sheet ( Hoja de datos )
| Número de pieza | NTZD3154N | |
| Descripción | Small Signal MOSFET 20V 540mA Dual N-Channel | |
| Fabricantes | ON Semiconductor | |
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NTZD3154N
Small Signal MOSFET
20 V, 540 mA, Dual N−Channel
Features
• Low RDS(on) Improving System Efficiency
• Low Threshold Voltage
• Small Footprint 1.6 x 1.6 mm
• ESD Protected Gate
• These are Pb−Free Devices
Applications
• Load/Power Switches
• Power Supply Converter Circuits
• Battery Management
• Cell Phones, Digital Cameras, PDAs, Pagers, etc.
http://onsemi.com
V(BR)DSS
20
RDS(on) Typ
400 mW @ 4.5 V
500 mW @ 2.5 V
700 mW @ 1.8 V
ID Max (Note 1)
540 mA
D1 D2
G1 G2
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted.)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Current
(Note 1)
Power Dissipation
(Note 1)
Steady TA = 25°C
State TA = 85°C
Steady State
VDSS 20 V
VGS
±6.0
V
DataS5h40eet4mUA.com
ID 390
PD 250 mW
Continuous Drain Current
(Note 1)
Power Dissipation
(Note 1)
tv5s
TA = 25°C
TA = 85°C
tv5s
ID
PD
570 mA
410
280 mW
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IDM
TTSJT,G
IS
TL
1.5
−55 to
150
350
260
A
°C
mA
°C
THERMAL RESISTANCE RATINGS
Parameter
Junction−to−Ambient – Steady State
(Note 1)
Junction−to−Ambient – t v 5 s (Note 1)
Symbol Max Unit
RqJA
500 °C/W
447
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu. area = 1.127 in sq [1 oz] including traces).
N−Channel
S1
MOSFET
S2
MARKING
DIAGRAM
6
1
SOT−563−6
CASE 463A
TV M G
G
TV = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PINOUT: SOT−563
S1 1
6 D1
G1 2
5 G2
D2 3
4 S2
Top View
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
DataShee
DataSheet4U.com
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 1
DataSheet4 U .com
1
Publication Order Number:
NTZD3154N/D
1 page  
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NTZD3154N
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE F
D
−X−
A
L
654
12 3
E
−Y−
HE
b 65 PL
e 0.08 (0.003) M X Y
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.50 0.55 0.60 0.020 0.021 0.023
b 0.17 0.22 0.27 0.007 0.009 0.011
C 0.08 0.12 0.18 0.003 0.005 0.007
D 1.50 1.60 1.70 0.059 0.062 0.066
E 1.10 1.20 1.30 0.043 0.047 0.051
e 0.5 BSC
0.02 BSC
L 0.10 0.20 0.30 0.004 0.008 0.012
HE 1.50 1.60 1.70 0.059 0.062 0.066
et4U.com
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
1.35 0.0394
0.0531 DataSheet4U.com
0.5 0.5
0.0197 0.0197
ǒ ǓSCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
http://onsemi.com
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ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NTZD3154N/D
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