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PDF TC74AC367F Data sheet ( Hoja de datos )

Número de pieza TC74AC367F
Descripción Hex Bus Buffer
Fabricantes Toshiba Semiconductor 
Logotipo Toshiba Semiconductor Logotipo



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TC74AC367P/F/FN/FT
TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic
TC74AC367P,TC74AC367F,TC74AC367FN,TC74AC367FT
Hex Bus Buffer (3-state)
The TC74AC367 is an advanced high speed CMOS HEX BUS
BUFFERs fabricated with silicon gate and double-layer metal
wiring C2MOS technology.
It achieves the high speed operation similar to equivalent
Bipolar Schottky TTL while maintaining the CMOS low power
dissipation.
It contains six buffers; four buffers are controlled by an enable
input ( G1 ), and the other two buffers are controlled by another
enable input ( G2 ). The outputs of each buffer group are enabled
when G1 and/or G2 inputs are held low; if held high, these
outputs are in a high impedance state.
All inputs are equipped with protection circuits against static
discharge or transient excess voltage.
Note: xxxFN (JEDEC SOP) is not available in
Japan.
TC74AC367P
TC74AC367F
Features
High speed: tpd = 3.7 ns (typ.) at VCC = 5 V
Low power dissipation: ICC = 8 µA (max) at Ta = 25°C
High noise immunity: VNIH = VNIL = 28% VCC (min)
Symmetrical output impedance: |IOH| = IOL = 24 mA (min)
Capability DofadtariSvihnege5t04U.com
transmission lines.
Balanced propagation delays: tpLH ∼− tpHL
Wide operating voltage range: VCC (opr) = 2 to 5.5 V
Pin and function compatible with 74F367
TC74AC367FN
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TC74AC367FT
Weight
DIP16-P-300-2.54A
: 1.00 g (typ.)
SOP16-P-300-1.27A
: 0.18 g (typ.)
SOP16-P-300-1.27
: 0.18 g (typ.)
SOL16-P-150-1.27
: 0.13 g (typ.)
TSSOP16-P-0044-0.65A : 0.06 g (typ.)
1
2006-02-01

1 page




TC74AC367F pdf
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Package Dimensions
TC74AC367P/F/FN/FT
et4U.com
Weight: 1.00 g (typ.)
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