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PDF NT5SV4M16DT Data sheet ( Hoja de datos )

Número de pieza NT5SV4M16DT
Descripción (NT5SVxxMxxDT) 64Mb Synchronous DRAM
Fabricantes NANYA 
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NT5SV16M4DT
NT5SV8M8DT
NT5SV4M16DT
64Mb Synchronous DRAM
Features
• High Performance:
-6K -7K
fCK
Clock
Frequency
166 133 143 133
tCK Clock Cycle 6 7.5 7 7.5
CL CAS Latency CL=3 CL=2 CL=3 CL=2
tAC
Clock Access
Time1
---
--- —
tAC
Clock Access
Time2
5.4
5.4
5.4
5.4
-7
143
7
CL=3
5.4
Units
MHz
ns
CKs
ns
ns
1. Terminated load. See AC Characteristics on page 16.
2. Unterminated load. See AC Characteristics on page 16.
• Single Pulsed RAS Interface
• Fully Synchronous to Positive Clock Edge
• Four Banks controlled by BS0/BS1 (Bank Select)
• Programmable CAS Latency: 2, 3
• Programmable Burst Length: 1, 2, 4, 8, Full page
• Programmable Wrap: Sequential or Interleave
• Multiple Burst Read with Single Write Option
• Automatic and Controlled Precharge Command
• Data Mask for Read/Write control (x4, x8)
• Dual Data Mask for byte control (x16)
• Auto Refresh (CBR) and Self Refresh
• Suspend Mode and Power Down Mode
• Standard Power operation
• 4096 refresh cycles/64ms
• Random Column Address every CK (1-N Rule)
• Single 3.3V ± 0.3V Power Supply
• LVTTL compatible
• Package: 54-pin 400 mil TSOP-Type II
Description
The NT5SV16M4DT, NT5SV8M8DT, and NT5SV4M16DT
are four-bank Synchronous DRAMs organized as 4Mbit x 4
I/O x 4 Bank, 2Mbit x 8 I/O x 4 Bank, and 1Mbit x 16 I/O x 4
Bank, respectively. These synchronous devices achieve
high-speed data transfer rates of up to 200MHz by employing
a pipeline chip architecture that synchronizes the output data
to a system clock. The chip is fabricated with NTC’s
advanced 64Mbit single transistor CMOS DRAM process
technology.
The device is designed to comply with all JEDEC standards
set for synchronous DRAM products, both electrically and
mechanically. All of the control, address, and data input/out-
put (I/O or DQ) circuits are synchronized with the positive
edge of an externally supplied clock.
RAS, CAS, WE, and CS are pulsed signals which are exam-
ined at the positive edge of each externally applied clock
(CK). Internal chip operating modes are defined by combina-
tions of these signals and a command decoder initiates the
necessary timings for each operation. A fourteen bit address
bus accepts address data in the conventional RAS/CAS mul-
tiplexing style. Twelve row addresses (A0-A11) and two bank
select addresses (BS0, BS1) are strobed with RAS. Eleven
column addresses (A0-A9) plus bank select addresses and
A10 are strobed with CAS. Column address A9 is dropped on
the x8 device, and column addresses A8 and A9 are dropped
on the x16 device.
Prior to any access operation, the CAS latency, burst length,
and burst sequence must be programmed into the device by
address inputs A0-A11, BS0, BS1 during a mode register set
cycle. In addition, it is possible to program a multiple burst
sequence with single write cycle for write through cache oper-
ation.
Operating the four memory banks in an interleave fashion
allows random access operation to occur at a higher rate
than is possible with standard DRAMs. A sequential and gap-
less data rate of up to 200MHz is possible depending on
burst length, CAS latency, and speed grade of the device.
Simultaneous operation of both decks of a stacked device is
allowed, depending on the operation being done. Auto
Refresh (CBR) and Self Refresh operation are supported.
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REV 1.1
10/01
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© NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.

1 page




NT5SV4M16DT pdf
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NT5SV16M4DT
NT5SV8M8DT
NT5SV4M16DT
64Mb Synchronous DRAM
Block Diagram
CKE CKE Buffer
CLK CLK Buffer
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A11
BS0
BS1
A10
Column Decoder
Cell Array
Memory Bank 0
Sense Amplifiers
Column Decoder
Cell Array
Memory Bank 1
Sense Amplifiers
DQ0
DQX
CS
RAS
CAS
WE
Column Decoder
Cell Array
Memory Bank 2
Sense Amplifiers
DQM
Column Decoder
Cell Array
Memory Bank 3
Sense Amplifiers
Cell Array, per bank, for 4Mb x 4 DQ: 4096 Row x 1024 Col x 4 DQ (DQ0-DQ3).
Cell Array, per bank, for 2Mb x 8 DQ: 4096 Row x 512 Col x 8 DQ (DQ0-DQ7).
Cell Array, per bank, for 1Mb x 16 DQ: 4096 Row x 256 Col x 16 DQ (DQ0-DQ15).
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REV 1.1
10/01
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© NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.

5 Page





NT5SV4M16DT arduino
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NT5SV16M4DT
NT5SV8M8DT
NT5SV4M16DT
64Mb Synchronous DRAM
Current State Truth Table (Part 2 of 3)(See note 1)
Command
Current State
CS RAS CAS WE BS0,BS1 A11 - A0
Description
Action
Notes
Read with
Auto Pre-
charge
LLLL
L L LH
LLHL
L LHH
LHL L
LHLH
L HH L
L HHH
HXXX
OP Code
Mode Register Set
X X Auto or Self Refresh
BS X Precharge
BS Row Address Bank Activate
BS Column Write
BS Column Read
X X Burst Termination
X X No Operation
X X Device Deselect
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
Continue the Burst
Continue the Burst
4
4
4
4
LLLL
L L LH
OP Code
XX
Mode Register Set ILLEGAL
Auto or Self Refresh ILLEGAL
LLHL
L LHH
Write with Auto
Precharge
L
H
L
L
LHLH
L HH L
L HHH
HXXX
LLLL
L L LH
LLHL
L LHH
BS X Precharge
BS Row Address Bank Activate
BS Column Write
BS Column Read
X X Burst Termination
X X No Operation
X X Device Deselect
OP Code
Mode Register Set
X X Auto or Self Refresh
BS X Precharge
BS Row Address Bank Activate
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
Continue the Burst
Continue the Burst
ILLEGAL
ILLEGAL
No Operation; Bank(s) idle after tRP
ILLEGAL
4
4
4
4
4
Precharging L H L L
LHLH
BS
BS
Column
Column
Write
Read
ILLEGAL
ILLEGAL
4
4
Row
Activating
L HH L
L HHH
HXXX
LLLL
L L LH
LLHL
L LHH
LHL L
LHLH
L HH L
L HHH
HXXX
X X Burst Termination
X X No Operation
X X Device Deselect
OP Code
Mode Register Set
X X Auto or Self Refresh
BS X Precharge
BS Row Address Bank Activate
BS Column Write
BS Column Read
X X Burst Termination
X X No Operation
X X Device Deselect
No Operation; Bank(s) idle after tRP
No Operation; Bank(s) idle after tRP
No Operation; Bank(s) idle after tRP
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
No Operation; Row Active after tRCD
No Operation; Row Active after tRCD
No Operation; Row Active after tRCD
4
4, 10
4
4
1. CKE is assumed to be active (high) in the previous cycle for all entries. The Current State is the state of the bank that the Command is
being applied to.
2. All Banks must be idle; otherwise, it is an illegal action.
3. If CKE is active (high) the SDRAM will start the Auto (CBR) Refresh operation, if CKE is inactive (low) than the Self Refresh mode is
entered.
4. The Current State refers to only one of the banks. If BS selects this bank then the action is illegal. If BS selects the bank not being refer-
enced by the Current State then the action may be legal depending on the state of that bank.
5. If CKE is inactive (low) then the Power Down mode is entered; otherwise there is a No Operation.
6. The minimum and maximum Active time (tRAS) must be satisfied.
7. The RAS to CAS Delay (tRCD) must occur before the command is given.
8. Column address A10 is used to determine if the Auto Precharge function is activated.
9. The command must satisfy any bus contention, bus turn around, and/or write recovery requirements.
10. The command is illegal if the minimum bank to bank delay time (tRRD) is not satisfied.
www.DataSheet4U.com
REV 1.1
10/01
11
© NANYA TECHNOLOGY CORP. All rights reserved.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.

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