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Número de pieza | P0402FCxxC | |
Descripción | FLIP CHIP ARRAY | |
Fabricantes | Protek Devices | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de P0402FCxxC (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
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Only One Name Means ProTek’Tion™
P0402FC3.3C*
thru
P0402FC36C*
FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 Line
✔ RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0402
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Tin-Lead or Lead-Free Plating
✔ Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
0402
www.DataSheet4U.com
05107.R9 4/05
1
*U.S. Patent No. Des. “D456,367S”
www.protekdevices.com
1 page www.DataSheet4U.com
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
P0402FC3.3C*
thru
P0402FC24C*
0402
TOP
D
E
F
H
END I
MOUNTING PAD
C
B
A
DIE
SOLDER
BUMP
I
SOLDER PRINT
DIAMETER 0.010” -
0.012”
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., P0402FC05C-T75-1).
3. 8mm Paper Tape: 7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., P0402FC05C-T710-2).
4. Suffix - LF = Lead-Free, i.e., P0402FC05C-LF-T75-1.
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
www.DataSheet4U.comcharacteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
05107.R9 4/05
5
PACKAGE DIMENSIONS
DIM MILLIMETERS
INCHES
A 0.46 NOM
B 0.86 NOM
C 0.99 ± 0.0254
D 0.10 NOM
E 0.35 NOM
F 0.483 ± 0.0254
G 0.20 NOM
H 0.127 MAX
0.076 MIN
I 0.406 NOM
0.018 NOM
0.034 NOM
0.039 ± 0.001
0.004 NOM
0.014 NOM
0.019 ± 0.001
0.008 NOM
0.005 MAX
0.003 MIN
0.016 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline:
.xxx ± 0.05mm (± 0.002”).
3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”).
PAD DIMENSIONS
DIM MILLIMETERS
INCHES
A 0.23
B 0.48
C 0.69
D 0.46
E 0.99
F 0.20
G 0.20
H 0.66
I 0.13
0.009
0.019
0.027
0.018
0.039
0.008
0.008
0.026
0.005
NOTE:
1. Top view of tape. Metal contacts are face down in tape
package.
TAPE & REEL ORIENTATION
Single Die - 0402
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev 3 - 11/02, 06001
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: [email protected]
Web Site: www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
www.protekdevices.com
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet P0402FCxxC.PDF ] |
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