NTF3055L175 Datasheet PDF - ON Semiconductor
| Part Number | NTF3055L175 | |
| Description | Power MOSFET 2 Amp | |
| Manufacturers | ON Semiconductor | |
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( DataSheet : www.DataSheet4U.com )
NTF3055L175
Preferred Device
Power MOSFET
2.0 A, 60 V, Logic Level
N−Channel SOT−223
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
VDSS
60
Drain−to−Gate Voltage (RGS = 1.0 MW)
VDGR
60
Gate−to−Source Voltage
− Continuous
− Non−repetitive (tp ≤ 10 ms)
VGS ± 15
± 20
Drain Current
− Continuous @ TA = 25°C
− Continuous @ TA = 100°C
− Single Pulse (tp ≤ 10 ms)
ID 2.0
ID 1.2
IDM 6.0
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
Derate above 25°C
PD 2.1
1.3
0.014
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
W
W
W/°C
Operating and Storage Temperature Range
TJ, Tstg − 55
to 175
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc,
IL(pk) = 3.6 A, L = 10 mH, VDS = 60 Vdc)
EAS 65 mJ
Thermal Resistance
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
RqJA
RqJA
°C/W
72.3
114
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
TL 260 °C
1. When surface mounted to an FR4 board using 1″ pad size, 1 oz. (Cu. Area
0.995 in2).
2. When surface mounted to an FR4 board using minimum recommended pad
size, 2−2.4 oz. (Cu. Area 0.272 in2).
http://onsemi.com
2.0 A, 60 V
RDS(on) = 175 mW
N−Channel
D
G
S
1
2
3
4
SOT−223
CASE 318E
STYLE 3
MARKING DIAGRAM
5L175 = Device Code
L = Location Code
WW = Work Week
5L175
LWW
PIN ASSIGNMENT
4 Drain
123
Gate Drain Source
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Preferred devices are recommended choices for future
use and best overall value.
www.DataSheet4U.com
www.D©aSteamSichoenedut4ctUor.Ccoommponents Industries, LLC, 2004
February, 2004 − Rev. 2
1
Publication Order Number:
NTF3055L175/D
|
| |
 
NTF3055L175
100
D = 0.5
10 0.2
0.1
0.05
1 0.01
SINGLE PULSE
0.1
0.00001
0.0001
0.001
TEST TYPE > MIN PAD 1 OZ
(Cu Area = 0.272 sq in)
< DIE SIZE 56 X 56 MILS
RqJC = MIN PAD 1 OZ
(Cu Area = 0.272 sq in) °C/W
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
0.01 0.1
t, TIME (s)
1
Figure 13. Thermal Response
10 100 1000
ORDERING INFORMATION
Device
Package
Shipping†
NTF3055L175T1
SOT−223 (TO−261)
1000 / Tape & Reel
NTF3055L175T1G
SOT−223 (TO−261)
(Pb−Free)
1000 / Tape & Reel
NTF3055L175T3
SOT−223 (TO−261)
4000 / Tape & Reel
NTF3055L175T3G
SOT−223 (TO−261)
(Pb−Free)
4000 / Tape & Reel
NTF3055L175T3LF
SOT−223 (TO−261)
4000 / Tape & Reel
NTF3055L175T3LFG
SOT−223 (TO−261)
(Pb−Free)
4000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5
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