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PDF NTF3055-100 Data sheet ( Hoja de datos )
| Número de pieza | NTF3055-100 | |
| Descripción | Power MOSFET 3 Amp | |
| Fabricantes | ON Semiconductor | |
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( DataSheet : www.DataSheet4U.com )
NTF3055-100
Preferred Device
Power MOSFET
3.0 Amps, 60 Volts
N–Channel SOT–223
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol Value
Drain–to–Source Voltage
VDSS 60
Drain–to–Gate Voltage (RGS = 10 MΩ)
VDGR 60
Gate–to–Source Voltage
– Continuous
– Non–repetitive (tp ≤ 10 ms)
VGS
± 20
± 30
Drain Current
– Continuous @ TA = 25°C
– Continuous @ TA = 100°C
– Single Pulse (tp ≤ 10 µs)
ID 3.0
ID 1.4
IDM 9.0
Total Power Dissipation @ TA = 25°C (Note 1.) PD
2.1
Total Power Dissipation @ TA = 25°C (Note 2.)
1.3
Derate above 25°C
0.014
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
W
W
W/°C
Operating and Storage Temperature Range
TJ, Tstg –55 to °C
175
Single Pulse Drain–to–Source Avalanche
Energy – Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc,
IL(pk) = 7.0 Apk, L = 3.0 mH, VDS = 60 Vdc)
EAS
74 mJ
Thermal Resistance
– Junction to Ambient (Note 1.)
– Junction to Ambient (Note 2.)
RθJA
RθJA
°C/W
72.3
114
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
TL 260 °C
1. When surface mounted to an FR4 board using 1″ pad size, 1 oz. (Cu. Area
1.127 in2).
2. When surface mounted to an FR4 board using minimum recommended pad
size, 2–2.4 oz. (Cu. Area 0.272 in2).
http://onsemi.com
3.0 AMPERES
60 VOLTS
RDS(on) = 100 mW
N–Channel
D
G
S
MARKING
DIAGRAM
1
2
3
4 SOT–223
CASE 318E
STYLE 3
3055
LWW
3055
L
WW
= Device Code
= Location Code
= Work Week
PIN ASSIGNMENT
4 Drain
123
Gate Drain Source
ORDERING INFORMATION
Device
Package Shipping
NTF3055–100T1
NTF3055–100T3
SOT–223 1000 Tape & Reel
SOT–223 4000 Tape & Reel
NTF3055–100T3LF SOT–223 4000 Tape & Reel
www.DataSheet4U.com
www.D© aSteamSichoenedut4ctUor.Ccoommponents Industries, LLC, 2001
July, 2001 – Rev. 0
1
Publication Order Number:
NTF3055–100/D
1 page  
10
1 x 1 inch 1 oz. Cu Pad (3 x 3 inch FR4)
NTF3055–100
1
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01 0.1
t, TIME (s)
1
Figure 13. Thermal Response
10 100 1000
http://onsemi.com
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