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PDF EMIF10-1K010F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF10-1K010F2 | |
| Descripción | EMI FILTER INCLUDING ESD PROTECTION | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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®
IPAD™
EMIF10-1K010F2
EMI FILTER
INCLUDING ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required
■ Mobile phones and communication systems
■ Computers, printers and MCU Boards
DESCRIPTION
The EMIF10-1K010F2 is a highly integrated
devices designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interferences. The EMIF10 flip chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV.
BENEFITS
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead free package
■ Very low PCB space consuming:
2.57 mm x 2.57 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration & wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4
15kV (air discharge)
8kV (contact discharge)
MIL STD 883E -Method 3015-6 Class 3
Figure 2: Basic Cell Configuration
Flip-Chip
(24 Bumps)
Table 1: Order Code
Part Number
EMIF10-1K010F2
Marking
FD
Figure 1: Pin Configuration (ball side)
5432
I7 GND GND I3
1
A
I9 GND GND I5
I1 B
I10 I8 I6 I4 I2 C
09 07 05 03 01 D
010 08 06 04 02 E
Input
Low-pass Filter
Output
Ri/o = 1kΩ
Cline = 100pF
GND
GND
GND
TM: IPAD is a trademark of STMicroelectronics.
October 2004
REV. 1
www.DataSheet4U1.c/7om
www.DataSheet4U.com
1 page  
EMIF10-1K010F2
Figure 11: Ordering Information Scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
= 3: Leadfree Pitch = 400µm, Bump = 250µm
Figure 12: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
650µm ± 65
2.57mm ± 50µm
250µm ± 40
Figure 13: Foot print recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 14: Marking
Dot, ST logo
xx = marking
z = packaging
location
yww = datecode
(y = year
ww = week)
All dimensions in µm
545 400
E
xxz
y ww
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF10-1K010F2.PDF ] | |
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