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PDF ICP-S Data sheet ( Hoja de datos )
| Número de pieza | ICP-S | |
| Descripción | Overcurrent Protection Elements | |
| Fabricantes | ROHM Semiconductor | |
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Overcurrent Protection Elements
ICP-S Technical Manual
ICP-S
ICP-S Technical Manual
1. Overview
The ICP-S is an IC protector of surface mounting type developed as an element for the protection of ICs from output
short-circuiting damage. The internal resistance of this lightweight, compact overcurrent protection element is low, as long
as the steady-state current of the element does not exceed the rated DC or AC current. The ICP-S, however, turns off ICs
instantly if the steady-state current reaches or exceeds the breaking current of the ICP-S.
2. External Dimensions (Unit: mm)
3.0±0.1
φ1.5
+0.1
−0
4.0±0.1
4.0±0.1
2.0±0.05
3.2±0.2
2.5±0.1
0.6 1.0
1.8±0.1
TN direction
φ1.15±0.1
2.8±0.2
(Mark: TN)
0.4±0.1
2.3±0.2
3. Features
1) Instantly breaks currents with a low potential drop.
(See 3-1 Potential Drop Comparison)
2) Compact surface-mounting model.
(See 2. External Dimensions)
3) Unlike fuses, there is no steady-state current reduction with the rated current applied. No derating is necessary.
4) Minimal breaking point dispersion.
(See the graph in 3-2 Breaking Current Dispersion
Characteristics)
5) Excellent temperature characteristics
(See the graphs in 3-3 Temperature Characteristics)
• The fluctuation of the breaking current caused by temperature changes is minimal.
• Wide operating temperature range: −55°C to +125°C
6) Excellent vibration resistance.
7) UL-approved product with certification No. 107856.
8) No deterioration or circuit breaking caused by static electricity.
Rev.A
1/13
1 page  
Overcurrent Protection Elements
ICP-S Technical Manual
5. Checks with I2t-tCharacteristic Graph
If the steady-state current includes a pulse, surge, or inrush-current, use the I2t
graph and check that the ICP will not deteriorate regardless of the mode of the
current or the ICP will not break the steady-state current while the ICP is in operation.
I2t-t Graph
I2t-t Graph
Breaking
current area
Deterioration
area
Margin area
Safety area
t (s)
Breaking current area: The ICP breaks the current in this area.
Deterioration area: Although the ICP does not break the current instantaneously,
the ICP may break the current as a result of ICP deterioration.
Marginal area: The area where the risk of ICP deterioration is low.
Basically avoid using this area.
Safety area: The ICP will not deteriorate or break the current.
Precautions
• Even though the Joule integral value of the current wave form designed at your end is
within the safety area, it is recommended that you confirm the steady-state current for
the safety of the components
Refer to the next section, calculate the I2t value, and check the position of the I2t value
in the graph. If the value is in the safety area, it is okay to use the selected ICP model.
If the value is, however, beyond the safety area, use an ICP model with higher ratings.
• Note: The inspection and selection of the ICP according to the Joule integral value is
absolutely based on the results of the approximation of the current wave form.
Be sure to inspect all the current wave forms of your application, or otherwise the safety
of the application will not be fully ensured.
• Consider a safety margin with the dispersion of component characteristics taken into
calculation when inspecting and selecting the ICP, if it is impossible to check the worst
current wave form.
Rev.A
5/13
5 Page 
Overcurrent Protection Elements
8. Application Circuit Example
8-1 Recommended Flow Soldering Conditions
ICP-S Technical Manual
(°C) Preheating
300
250
200
150
120°C
100
100°C
50
25
2 minutes min.
5 minutes min.
Soldering
Natural cooling
260°C
230°C
10 seconds min. 1 minute min.
Manual soldering conditions
Soldering iron temperature: 350°C max.
Soldering time: 3 seconds max.
8-2 Recommended Reflow Soldering Conditions
(°C) Peak temperature
230 to 260°C, 10sec Max.
250
Reflow heating temperature
200 1 to 5°C / sec
150
100
50
Preheating
speed
0 1 to 5°C / sec
Preheating
120 to 160°C,
50 to 120 sec
∗ Number of reflow times: 2 TIMES Max.
Reflow soldering
(High-temperature
retention time)
200°C,
30 to 60 sec
Cooling
60sec Min.
A peak temperature of at least 230°C is recommended. If the peak temperature is less than 230°C, it is recommended to
make some adjustments, such as the retention of the peak temperature and soldering time longer and an increase in the thickness
of solder paste.
8-3 Recommended Copper Pattern on PCB
1.6 to 2.0
4.0 to 5.0
Rev.A
11/13
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet ICP-S.PDF ] | |
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