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PDF HPL1117 Data sheet ( Hoja de datos )
| Número de pieza | HPL1117 | |
| Descripción | 1A Low Dropout Fast Response Positive Adjustable Regulator | |
| Fabricantes | HiPAC | |
| Logotipo |  |
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HPL1117
1A Low Dropout Fast Response Positive Adjustable Regulator and Fixed
1.8V, 2.5V, 2.85V, 3.3V and 5V
Features
General Description
• Guaranteed Output Voltage Accuracy within 2% The HPL1117 is a low dropout three-terminal adjust-
able regulators with 1A output current capability. In
• Fast Transient Response
order to obtain lower dropout voltage and faster tran-
• Guaranteed Dropout Voltage at Multiple
Currents
sient response, which is critical for low voltage ap-
plications , the HPL1117 has been optimized. The
device is available in an adjustable version and fixed
• Load Regulation : 0.1% Typ.
• Line Regulation : 0.03% Typ.
output voltages of 1.8V, 2.5V, 2.85V, 3.3V and 5V.
The output available voltage range of an adjustable
version is from 1.25~10.7V with an input supply be-
• Low Dropout Voltage : 1.1V Typ. at IOUT =1A
• Current Limit : 1A Typ. at TJ=25°C
low 12V. Dropout voltage is guaranteed at a maxi-
mum of 1.3V at 1A. Current limit is trimmed to ensure
specified output current and controlled short-circuit
• On-Chip Thermal Limiting : 150°C Typ.
• Adjustable Output : 1.25~10.7V
current. On-chip thermal limiting provides protection
against any combination of overload that would cre-
ate excessive junction temperatures. The HPL1117
• Standard 3-pin TO-220, TO-252, TO-263 and
SOT-223 Power Packages
is available in the industry standard 3-pin TO-220, TO-
252, TO-263, and the low profile surface mount SOT-
223 power packages which can be used in applica-
tions where space is limited.
Applications
Pin Description
• Active SCSI Terminators
• Low Voltage Logic Supplies
• Post Regulator for Switching Power Supply
Front View for TO-220
3 VIN
2 VOUT
1 ADJ/GND
Front View for TO-263
TAB is VOUT
3 VIN
2V
OUT
1 ADJ/GND
Front View for TO-252
3 VIN
TAB IS VOUT
2 VOUT
1 ADJ/GND
Copyright HIPAC Semiconductor, Inc.
Rev. B.13 - Mar., 2004
1
www.hipacsemi.com
1 page  
HPL1117
Block Diagram
V IN
VOUT
T herm al
Protection
Current
Lim it
Voltage
Regulation
ADJ/GND
Application Circuits
1.25V to 10.7V Adjustable Regulator
Improving Ripple Rejection
HPL1117
VIN IN OUT
ADJ R1
121Ω
+ 10µ F
C1*
R2
1k
VOUT1
+ 100µ F
C2
* Needed if device is far from filter capacitors
VOUT
=
1.250V
X
R1 + R2
R1
VIN
+
10µF
HPL1117
IN OUT
ADJ
R2
365Ω
1%
R1
121Ω
1%
+ C1
10µF
VOUT
150µF
* C1 improves ripple rejection.
XC should be approximately
equal to R1 at ripple frequency
Copyright HIPAC Semiconductor, Inc.
Rev. B.13 - Mar., 2004
5
www.hipacsemi.com
5 Page 
HPL1117
Application Information (Cont.)
Output Capacitor (Cont.)
Aluminum electrolytics can also be used, as long as
the ESR of the capacitor is <1Ω. The value of the
output capacitor can be increased without limit. Higher
capacitance values help to improve transient response
and ripple rejection and reduce output noise.
Ripple Rejection
The curves for Ripple Rejection were generated us-
ing an adjustable device with the adjust pin bypassed.
With a 22µF bypassing capacitor 75dB ripple rejec-
tion is obtainable at any output level. The impedance
of the adjust pin capacitor, at the ripple frequency,
should be < R1. R1 is normally in the range of 100Ω-
200Ω. The size of the required adjust pin capacitor
is a function of the input ripple frequency. At 120Hz,
with R1=100Ω, the adjust pin capacitor should be
13µF. For fixed voltage devices, and adjustable de-
vices without an adjust pin capacitor, the output ripple
will increase as the ratio of the output voltage to the
reference voltage (VOUT /VREF ).
Figure 3&4 shows for the TO-252 and SOT-223 the
measured values of θ(J-A) for different copper area
sizes using a 2 layers, 1.6mm, and 6Sq. cm FR-4
PCB with 2oz. copper and a ground plane layer on
the backside area used for heatsinking. It can be
used as a rough guideline in estimating thermal
resistance.
50
TA=25°C
45
40
35
30
25
0 2 4 6 8 10 12 14
Top Copper Area (cm2)
Figure 3.
θ(J-A) vs. copper area for the TO-252 package
Thermal Considerations
HPL1117 has thermal protection which limits junction
temperature to 150°C. However, device functionality
is only guaranteed to a maximum junction tempera-
ture of +125°C.
Both the TO-220, TO-252, TO-263 and SOT-223
packages use a copper plane on the PCB and the
PCB itself as a heatsink. To optimize the heat sinking
ability of the plane and PCB, solder the tab of the
package to the plane.
Copyright HIPAC Semiconductor, Inc.
Rev. B.13 - Mar., 2004
11
www.hipacsemi.com
11 Page | ||
| Páginas | Total 19 Páginas | |
| PDF Descargar | [ Datasheet HPL1117.PDF ] | |
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