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Intel - (TE28F Series) SMART 3 ADVANCED BOOT BLOCK 4-8-16-32-MBIT FLASH MEMORY FAMILY

Numéro de référence TE28F016B3xxx
Description (TE28F Series) SMART 3 ADVANCED BOOT BLOCK 4-8-16-32-MBIT FLASH MEMORY FAMILY
Fabricant Intel 
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TE28F016B3xxx fiche technique
E
PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK
4-, 8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F400B3, 28F800B3, 28F160B3, 28F320B3
28F008B3, 28F016B3, 28F032B3
n Flexible SmartVoltage Technology
2.7 V–3.6 V Read/Program/Erase
12 V VPP Fast Production
Programming
n 2.7 V or 1.65 V I/O Option
Reduces Overall System Power
n High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
n Optimized Block Sizes
Eight 8-KB Blocks for Data,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks for
Code
n Block Locking
VCC-Level Control through WP#
n Low Power Consumption
10 mA Typical Read Current
n Absolute Hardware-Protection
VPP = GND Option
VCC Lockout Voltage
n Extended Temperature Operation
–40 °C to +85 °C
n Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., Voice)
n Automated Program and Block Erase
Status Registers
n Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles Guaranteed
n Automatic Power Savings Feature
Typical ICCS after Bus Inactivity
n Standard Surface Mount Packaging
48-Ball µBGA* Package
48-Lead TSOP Package
40-Lead TSOP Package
n Footprint Upgradeable
Upgrade Path for 4-, 8-, 16-, and 32-
Mbit Densities
n ETOX™ VI (0.25 µ) Flash Technology
The Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and
interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single
device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective,
monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-
lead and 48-lead TSOP and 48-ball µBGA* packages. Additional information on this product family can be
obtained by accessing Intel’s WWW page: http://www.intel.com/design/flash.
July 1998
Order Number: 290580-005

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