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PDF TE28F160C3 Data sheet ( Hoja de datos )

Número de pieza TE28F160C3
Descripción (TE28Fxxx) 3 Volt Advanced Boot Block Flash Memory
Fabricantes Intel Corporation 
Logotipo Intel Corporation Logotipo



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No Preview Available ! TE28F160C3 Hoja de datos, Descripción, Manual

3 Volt Intel® Advanced+ Boot Block
Flash Memory
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Preliminary Datasheet
Product Features
s Flexible SmartVoltage Technology
s 128-bit Protection Register
— 2.7 V–3.6 V Read/Program/Erase
— 64-bit Unique Device Identifier
— 12 V for Fast Production Programming
— 64-bit User Programmable OTP Cells
s 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option s Extended Cycling Capability
— Reduces Overall System Power
s High Performance
— 2.7 V–3.6 V: 70 ns Max Access Time
s Optimized Architecture for Code Plus Data
Storage
— Minimum 100,000 Block Erase Cycles
s Supports Intel® Flash Data Integrator
Software
— Flash Memory Manager
— System Interrupt Manager
— Eight 4-Kword Blocks, Top or Bottom
— Supports Parameter Storage, Streaming
Locations
Data (e.g., voice)
— Up to One Hundred-Twenty-Seven 32- s Automated Word/Byte Program and Block
Kword Blocks
Erase
— Fast Program Suspend Capability
— Command User Interface
— Fast Erase Suspend Capability
— Status Registers
s Flexible Block Locking
— Lock/Unlock Any Block
s Cross-Compatible Command Support
— Intel Basic Command Set
— Full Protection on Power-Up
— Common Flash Interface
— WP# Pin for Hardware Block Protection
— VPP = GND Option
— VCC Lockout Voltage
s Low Power Consumption
— 9 mA Typical Read Power
s
s
Standard Surface Mount Packaging
— 48-Ball CSP Packages
— 64-Ball Easy BGA Packages
— 48-Lead TSOP Package
ETOX™ VII (0.18 µ) Flash Technology
— 7 µ A Typical Standby Power with
— 28F160/320/640C3xC
Automatic Power Savings Feature
— 8-, 16- and 32-Mbit also exist on
s 12 V Fast Production Program
s Extended Temperature Operation
ETOX™ VI (0.25 µ) Flash Technology
— –40 °C to +85 °C
The 3 Volt Advanced+ Boot Block Flash memory, manufactured on Intel’s latest 0.18 µ
technology, represents a feature-rich solution for low power applications. 3 Volt Advanced+
Boot Block Flash memory devices incorporate low voltage capability (2.7 V read, program and
erase) with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel® Flash Data Integrator (IFDI) software
and you have a cost-effective, flexible, monolithic code plus data storage solution. Intel® 3 Volt
Advanced+ Boot Block products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball
mEasy BGA packages. Additional information on this product family can be obtained by
oaccessing the Intel® Flash website: http://www.intel.com/design/flash.
t4u.cNotice: This document contains preliminary information on new products in production. The
e specifications are subject to change without notice. Verify with your local Intel sales office that
e you have the latest datasheet before finalizing a design.
tash Order Number: 290645-011
www.da August 2001

1 page




TE28F160C3 pdf
28F320W30, 28F3204W30, 28F6408W30, 28F640W30
Revision History
Date of
Revision
05/12/98
07/21/98
10/03/98
12/04/98
12/31/98
02/24/99
06/10/99
03/20/00
04/24/00
10/12/00
8/20/01
Version
-001
-002
-003
-004
-005
-006
-007
-008
-009
-010
-011
Description
Original version
48-Lead TSOP package diagram change
µBGA package diagrams change
32-Mbit ordering information change (Section 6)
CFI Query Structure Output Table Change (Table C2)
CFI Primary-Vendor Specific Extended Query Table Change for Optional
Features and Command Support change (Table C8)
Protection Register Address Change
IPPD test conditions clarification (Section 4.3)
µBGA package top side mark information clarification (Section 6)
Byte-Wide Protection Register Address change
VIH Specification change (Section 4.3)
VIL Maximum Specification change (Section 4.3)
ICCS test conditions clarification (Section 4.3)
Added Command Sequence Error Note (Table 7)
Datasheet renamed from 3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash
Memory Family.
Added tBHWH/tBHEH and tQVBL (Section 4.6)
Programming the Protection Register clarification (Section 3.4.2)
Removed all references to x8 configurations
Removed reference to 40-Lead TSOP from front page
Added Easy BGA package (Section 1.2)
Removed 1.8 V I/O references
Locking Operations Flowchart changed (Appendix B)
Added tWHGL (Section 4.6)
CFI Primary Vendor-Specific Extended Query changed (Appendix C)
Max ICCD changed to 25 µA
Table 10, added note indicating VCCMax = 3.3 V for 32-Mbit device
Added specifications for 0.18 micron product offerings throughout document
Added 64-Mbit density
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the
faster product offering
Changed VccMax=3.3V reference to indicate that the affected product is the
0.25µm 32Mbit device
Minor text edits
Added 1.8 V I/O operation documentation where applicable
Added TSOP PCN ‘Pin-1’ indicator information
Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘VSSQ
Added ‘VSSQ’ to Pin Descriptions Information
Removed 0.4 µm references in DC Characteristics table
Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA
Corrected ‘bottom’ boot block sizes to on 8Mb device to 8 x 4KWords
Minor text edits
Preliminary
v

5 Page





TE28F160C3 arduino
28F800C3, 28F160C3, 28F320C3, 28F640C3
Products affected are Intel Ordering Codes:
Table 2. Intel Ordering Codes
Extended
32 Mbit
Extended
16 Mbit
Extended
8 Mbit
48-Lead TSOP
TE28F320C3TC70
TE28F320C3BC70
TE28F320C3TC90
TE28F320C3BC90
TE28F320C3TA100
TE28F320C3BA100
TE28F320C3TA110
TE28F320C3BA110
TE28F160C3TC70
TE28F160C3BC70
TE28F160C3TC80
TE28F160C3BC80
TE28F160C3TA90
TE28F160C3BA90
TE28F160C3TA110
TE28F160C3BA110
TE28F800C3TA90
TE28F800C3BA90
TE28F800C3TA110
TE28F800C3BA110
Preliminary
5

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