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Intel Corporation - (TE28Fxxx) 3 Volt Advanced Boot Block Flash Memory

Numéro de référence TE28F320C3
Description (TE28Fxxx) 3 Volt Advanced Boot Block Flash Memory
Fabricant Intel Corporation 
Logo Intel Corporation 





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TE28F320C3 fiche technique
3 Volt Intel® Advanced+ Boot Block
Flash Memory
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Preliminary Datasheet
Product Features
s Flexible SmartVoltage Technology
s 128-bit Protection Register
— 2.7 V–3.6 V Read/Program/Erase
— 64-bit Unique Device Identifier
— 12 V for Fast Production Programming
— 64-bit User Programmable OTP Cells
s 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option s Extended Cycling Capability
— Reduces Overall System Power
s High Performance
— 2.7 V–3.6 V: 70 ns Max Access Time
s Optimized Architecture for Code Plus Data
Storage
— Minimum 100,000 Block Erase Cycles
s Supports Intel® Flash Data Integrator
Software
— Flash Memory Manager
— System Interrupt Manager
— Eight 4-Kword Blocks, Top or Bottom
— Supports Parameter Storage, Streaming
Locations
Data (e.g., voice)
— Up to One Hundred-Twenty-Seven 32- s Automated Word/Byte Program and Block
Kword Blocks
Erase
— Fast Program Suspend Capability
— Command User Interface
— Fast Erase Suspend Capability
— Status Registers
s Flexible Block Locking
— Lock/Unlock Any Block
s Cross-Compatible Command Support
— Intel Basic Command Set
— Full Protection on Power-Up
— Common Flash Interface
— WP# Pin for Hardware Block Protection
— VPP = GND Option
— VCC Lockout Voltage
s Low Power Consumption
— 9 mA Typical Read Power
s
s
Standard Surface Mount Packaging
— 48-Ball CSP Packages
— 64-Ball Easy BGA Packages
— 48-Lead TSOP Package
ETOX™ VII (0.18 µ) Flash Technology
— 7 µ A Typical Standby Power with
— 28F160/320/640C3xC
Automatic Power Savings Feature
— 8-, 16- and 32-Mbit also exist on
s 12 V Fast Production Program
s Extended Temperature Operation
ETOX™ VI (0.25 µ) Flash Technology
— –40 °C to +85 °C
The 3 Volt Advanced+ Boot Block Flash memory, manufactured on Intel’s latest 0.18 µ
technology, represents a feature-rich solution for low power applications. 3 Volt Advanced+
Boot Block Flash memory devices incorporate low voltage capability (2.7 V read, program and
erase) with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel® Flash Data Integrator (IFDI) software
and you have a cost-effective, flexible, monolithic code plus data storage solution. Intel® 3 Volt
Advanced+ Boot Block products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball
mEasy BGA packages. Additional information on this product family can be obtained by
oaccessing the Intel® Flash website: http://www.intel.com/design/flash.
t4u.cNotice: This document contains preliminary information on new products in production. The
e specifications are subject to change without notice. Verify with your local Intel sales office that
e you have the latest datasheet before finalizing a design.
tash Order Number: 290645-011
www.da August 2001

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