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HCPL-0452 fiches techniques PDF

Hewlett-Packard - (HCPL-xxxx) Single Channel / High Speed Optocouplers

Numéro de référence HCPL-0452
Description (HCPL-xxxx) Single Channel / High Speed Optocouplers
Fabricant Hewlett-Packard 
Logo Hewlett-Packard 





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HCPL-0452 fiche technique
Single Channel, High Speed
Optocouplers
Technical Data
Features
Applications
sheet4u.com6N135/6
taHCNW135/6
HCNW4502/3
aHCPL-2502
.dHCPL-0452/3
HCPL-0500/1
wwwHCPL-4502/3
Description
• 15 kV/µs Minimum Common
Mode Transient Immunity at
VCM = 1500 V (4503/0453)
• High Speed: 1 Mb/s
• TTL Compatible
• Available in 8-Pin DIP, SO-8,
Widebody Packages
• Open Collector Output
• Guaranteed Performance
from Temperature: 0°C
to 70°C
• Safety Approval
UL Recognized – 2500 V rms
for 1 minute (5000 V rms for
1 minute for HCNW and
Option 020 devices) per
UL1577
CSA Approved
VDE 0884 Approved
–VIORM = 630 V peak for
HCPL-4503#060
–VIORM = 1414 V peak for
HCNW devices
• Dual Channel Version
Available (253X/4534/053X/
0534)
• MIL-STD-1772 Version
Available (55XX/65XX/4N55)
• High Voltage Insulation
• Video Signal Isolation
• Power Transistor Isolation
in Motor Drives
• Line Receivers
• Feedback Element in
Switched Mode Power
Supplies
• High Speed Logic Ground
Isolation – TTL/TTL, TTL/
CMOS, TTL/LSTTL
• Replaces Pulse Transformers
• Replaces Slow
Phototransistor Isolators
• Analog Signal Ground
Isolation
These diode-transistor optocoup-
lers use an insulating layer
between a LED and an integrated
photodetector to provide elec-
trical insulation between input
and output. Separate connections
for the photodiode bias and
output-transistor collector
increase the speed up to a
hundred times that of a conven-
tional phototransistor coupler by
reducing the base-collector
capacitance.
Functional Diagram
NC 1
ANODE 2
CATHODE 3
NC 4
8 VCC
*
7 VB
6 VO
5 GND
TRUTH TABLE
(POSITIVE LOGIC)
LED
VO
ON
OFF
LOW
HIGH
* NOTE: FOR 4502/3, 0452/3,
PIN 7 IS NOT CONNECTED.
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.

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