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Número de pieza | UPD23C16300 | |
Descripción | 16M-BIT MASK-PROGRAMMABLE ROM | |
Fabricantes | NEC | |
Logotipo | ||
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No Preview Available ! DATA SHEET
MOS INTEGRATED CIRCUIT
µPD23C16300
16M-BIT MASK-PROGRAMMABLE ROM
2M-WORD BY 8-BIT (BYTE MODE) / 1M-WORD BY 16-BIT (WORD MODE)
Description
The µPD23C16300 is a 16,777,216 bits mask-programmable ROM. The word organization is selectable (BYTE mode :
2,097,152 words by 8 bits, WORD mode : 1,048,576 words by 16 bits).
The active levels of OE (Output Enable Input) can be selected with mask-option.
The µPD23C16300 is packed in 48-pin PLASTIC TSOP(I) and 48-pin TAPE FBGA.
Features
• Pin compatible with NOR Flash Memory
• Word organization
2,097,152 words by 8 bits (BYTE mode)
1,048,576 words by 16 bits (WORD mode)
• Operating supply voltage : VCC = 2.7 V to 3.6 V
Operating supply voltage
VCC
3.0 V ± 0.3 V
3.3 V ± 0.3 V
Access time
ns (MAX.)
90
85
Power supply current (Active mode)
mA (MAX.)
30
Standby current (CMOS level input)
µA (MAX.)
30
Ordering Information
Part Number
µPD23C16300GZ-xxx-MJH
µPD23C16300F9-xxx-BC3
Package
48-pin PLASTIC TSOP(I) (12 x 20) (Normal bent)
48-pin TAPE FBGA (8 x 6)
(xxx : ROM code suffix No.)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. M15705EJ2V0DS00 (2nd edition)
Date Published February 2003 NS CP(K)
Printed in Japan
The mark shows major revised points.
2001
1 page Block Diagram
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
µPD23C16300
O8 O9 O10 O11 O12 O13 O14 O15, A 1
O0 O1 O2 O3 O4 O5 O6 O7
Output Buffer
Y-Selector
WORD, /BYTE
/OE or OE or DC
Memory Cell Matrix
1,048,576 words by 16 bits /
2,097,152 words by 8 bits
/CE
Data Sheet M15705EJ2V0DS
5
5 Page Package Drawings
48-PIN PLASTIC TSOP (I) (12x20)
1
48
24
K
25
P
IJ
S
NS
µPD23C16300
detail of lead end
F
G
R
Q
E
A
L
S
C
D MM
B
NOTES
1) Each lead centerline is located within 0.10 mm of
its true position (T.P.) at maximum material condition.
2) "A" excludes mold flash. (Includes mold flash : 12.4 mm MAX.)
ITEM MILLIMETERS
A 12.0±0.1
B 0.45 MAX.
C 0.5 (T.P.)
D 0.22±0.05
E 0.1±0.05
F 1.2 MAX.
G 1.0±0.05
I 18.4±0.1
J 0.8±0.2
K 0.145±0.05
L 0.5
M 0.10
N 0.10
P 20.0±0.2
Q 3°+−53°°
R 0.25
S 0.60±0.15
S48GZ-50-MJH-1
Data Sheet M15705EJ2V0DS
11
11 Page |
Páginas | Total 16 Páginas | |
PDF Descargar | [ Datasheet UPD23C16300.PDF ] |
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