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PDF BLA1011-2 Data sheet ( Hoja de datos )
| Número de pieza | BLA1011-2 | |
| Descripción | Avionics LDMOS transistor | |
| Fabricantes | NXP Semiconductors | |
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DISCRETE SEMICONDUCTORS
DATA SHEET
M3D438
BLA1011-2
Avionics LDMOS transistor
Product specification
Supersedes data of 2002 Oct 02
2003 Nov 19
1 page  
Philips Semiconductors
Avionics LDMOS transistor
Product specification
BLA1011-2
handbook, full pagewidth
110
C11
C4
C5
C3 R2
C10
60
C1
C2 R1
C6 C7
C8 C9
57
7.5 13.5
41
MGU487
Dimensions in mm.
The components are situated on one side of the Rogers 6006 printed-circuit board (thickness = 0.64 mm; εr = 6.2), the other side is unetched
and serves as a ground plane. Earth connections from the component side to the ground plane are made by through-metallization.
Fig.6 Printed-circuit board for class-AB test circuit.
List of components for class-AB test circuit (see Fig.6)
COMPONENT
C1, C8
C2
C3
C4, C10
C5
C6
C7
C9
C11
R1
R2
DESCRIPTION
multilayer ceramic chip capacitor; note 1
multilayer ceramic chip capacitor; note 1
multilayer ceramic chip capacitor; note 1
multilayer ceramic chip capacitor; note 2
multilayer ceramic chip capacitor; note 3
multilayer ceramic chip capacitor; note 1
multilayer ceramic chip capacitor; note 3
tekelec trimmer; type 37283
multilayer ceramic chip capacitor; note 1
SMD resistor
SMD resistor
Notes
1. American Technical Ceramics type 100A or capacitor of same quality.
2. American Technical Ceramics type 200B or capacitor of same quality.
3. American Technical Ceramics type 100B or capacitor of same quality.
VALUE
56 pF
7.5 pF
1.8 pF
20 nF
33 pF
5.6 pF
6.2 pF
0.4 to 2.5 pF
33 pF
2.2 Ω (2 in parallel)
22 Ω
2003 Nov 19
5
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet BLA1011-2.PDF ] | |
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