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PDF ICS508 Data sheet ( Hoja de datos )
| Número de pieza | ICS508 | |
| Descripción | PECL to CMOS Converter | |
| Fabricantes | Integrated Circuit Systems | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de ICS508 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
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PRELIMINARY INFORMATION
ICS508
PECL to CMOS Converter
Description
The ICS508 is the most cost effective way to
generate a high quality, high frequency CMOS
clock output from a PECL clock input.
The ICS508 has separate VDD supplies for the
PECL input buffer and the output buffer allowing
different voltages to be used. For example, the
input clock could use a 3.3 V supply while the
output operates from 2.5 V.
The device has an Output Enable pin that tri-states
the clock output when the OE pin is taken low.
The ICS508 is a member of the ClockBlocks™
family of devices.
Features
• Packaged as 8 pin SOIC or die
• Separate VDD supplies allow voltage
translation
• Clock frequency of 0 - 250 MHz
• Duty cycle of 45/55
• Operating voltages of 2.375 to 5.5 V
• Tri-state output for board level testing
• 24 mA drive capability
• Industrial temperature version available
• Advanced, low power CMOS process
Block Diagram
VDDP
VDDC
PECLIN
PECLIN
GND
Output
Buffer
CLK
OE GND
MDS 508 C
1
Revision 012400
Printed 11/13/00
Integrated Circuit Systems, Inc. • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel • www.icst.com
1 page  
PRELIMINARY INFORMATION
ICS508
PECL to CMOS Converter
External Components
The ICS508 requires two 0.01µF decoupling capacitors to be connected between VDDP and GND and
between VDDC and GND. They must be connected close to the ICS508 to minimize lead inductance. A
33 Ω series terminating resistor can be used next to the CLK pin.
Package Outline and Package Dimensions
(For current dimensional specifications, see JEDEC Publication No. 95.)
INDEX
AREA
12
D
EH
h x 45°
8 pin SOIC
Symbol
A
A1
B
C
D
E
e
H
h
L
Inches
Min Max
0.0532 0.0688
0.0040 0.0098
0.0130 0.0200
0.0075 0.0098
0.1890 0.1968
0.1497 0.1574
.050 BSC
0.2284 0.2440
0.0099 0.0195
0.0160 0.0500
Millimeters
Min Max
1.35 1.75
0.10 0.24
0.33 0.51
0.19 0.24
4.80 5.00
3.80 4.00
1.27 BSC
5.80 6.20
0.25 0.50
0.41 1.27
A1
e
C
B
Ordering Information
Part/Order Number
ICS508M
ICS508MT
ICS508MI
ICS508MIT
ICS508-DWF
ICS508-DPK
Marking
ICS508M
ICS508M
ICS508I
ICS508I
-
-
A
L
Package
8 pin SOIC
8 pin SOIC on tape and reel
8 pin SOIC
8 pin SOIC on tape and reel
Die on uncut, probed wafers
Tested die in waffle pack
Temperature
0 to 70 °C
0 to 70 °C
-40 to +85 °C
-40 to +85 °C
0 to 70 °C
0 to 70 °C
While the information presented herein has been checked for both accuracy and reliability, ICS assumes no responsibility for either its use or for the infringement of any patents or
other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications.
Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without
additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support
devices or critical medical instruments.
MDS 508 C
5
Revision 012400
Printed 11/13/00
Integrated Circuit Systems, Inc. • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel • www.icst.com
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet ICS508.PDF ] | |
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