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PDF MC74VHC08 Data sheet ( Hoja de datos )
| Número de pieza | MC74VHC08 | |
| Descripción | Quad 2-Input AND Gate | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MC74VHC08
Quad 2−Input AND Gate
The MC74VHC08 is an advanced high speed CMOS 2−input AND
gate fabricated with silicon gate CMOS technology. It achieves high
speed operation similar to equivalent Bipolar Schottky TTL while
maintaining CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output. The
inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V
systems to 3.0 V systems.
Features
• High Speed: tPD = 4.3 ns (Typ) at VCC = 5.0 V
• Low Power Dissipation: ICC = 2.0 mA (Max) at TA = 25°C
• High Noise Immunity: VNIH = VNIL = 28% VCC
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
• Designed for 2.0 V to 5.5 V Operating Range
• Low Noise: VOLP = 0.8 V (Max)
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300 mA
• ESD Performance:
Human Body Model > 2000 V;
Machine Model > 200 V
• Chip Complexity: 24 FETs or 6 Equivalent Gates
• Pb−Free Packages are Available*
www.DataSheet4U.com
A1 1
2
B1
A2 4
5
B2
9
A3
10
B3
A4 12
13
B4
3
Y1
6
Y2
Y = AB
8 Y3
11
Y4
Figure 1. Logic Diagram
VCC B4 A4 Y4 B3 A3 Y3
14 13 12 11 10 9 8
http://onsemi.com
MARKING
DIAGRAMS
14
SOIC−14
D SUFFIX
CASE 751A
1
VHC08G
AWLYWW
TSSOP
DT SUFFIX
CASE 948G
14
VHC
08
ALYW G
G
1
14
SOEIAJ−14
M SUFFIX
CASE 965
74VHC08
ALYWG
1
A = Assembly Location
WL, L = Wafer Lot
Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
FUNCTION TABLE
Inputs
Output
AB
Y
LL
LH
HL
HH
L
L
L
H
1234567
A1 B1 Y1 A2 B2 Y2 GND
(Top View)
Figure 2. Pinout: 14−Lead Packages
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
November, 2005 − Rev. 6
1
Publication Order Number:
MC74VHC08/D
1 page  
MC74VHC08
PACKAGE DIMENSIONS
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE G
−A−
14
8
1
G
−B− P 7 PL
0.25 (0.010) M B M
7
C R X 45 _
−T−
SEATING
PLANE
D 14 PL
K
0.25 (0.010) M T B S A S
M
F
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
TSSOP−14
DT SUFFIX
CASE 948G−01
ISSUE A
0.15 (0.006) T U S
2X L/2 14
L
PIN 1
IDENT.
1
14X K REF
0.10 (0.004) M T U S V S
N 0.25 (0.010)
8
M
B
−U− N
F
7 DETAIL E
0.15 (0.006) T U S
A
−V−
K
J J1 ÇÇÉÉÇÇÉÉK1ÇÇÉÉ
SECTION N−N
0.10 (0.004)
−T− SEATING
PLANE
D
C
G
H DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
−W−
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC
0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
http://onsemi.com
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