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IRFZ44NS fiches techniques PDF

NXP Semiconductors - N-channel enhancement mode TrenchMOS transistor

Numéro de référence IRFZ44NS
Description N-channel enhancement mode TrenchMOS transistor
Fabricant NXP Semiconductors 
Logo NXP Semiconductors 





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IRFZ44NS fiche technique
Philips Semiconductors
N-channel enhancement mode
TrenchMOSTM transistor
Product specification
IRFZ44NS
GENERAL DESCRIPTION
N-channel enhancement mode
standard level field-effect power
transistor in a surface mounting
plastic envelope using ’trench
technology. The device features very
low on-state resistance and has
integral zener diodes giving ESD
protection up to 2kV. It is intended for
use in switched mode power supplies
and general purpose switching
applications.
PINNING - SOT404 (D2PAK)
PIN DESCRIPTION
1 gate
2 drain
3 source
mb drain
QUICK REFERENCE DATA
SYMBOL PARAMETER
VDS
ID
Ptot
Tj
RDS(ON)
Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance
VGS = 10 V
MAX.
55
49
110
175
22
PIN CONFIGURATION
mb
2
13
SYMBOL
d
g
s
UNIT
V
A
W
˚C
m
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
VDS
VDGR
±VGS
ID
ID
IDM
Ptot
Tstg, Tj
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Total power dissipation
Storage & operating temperature
-
RGS = 20 k
-
Tmb = 25 ˚C
Tmb = 100 ˚C
Tmb = 25 ˚C
Tmb = 25 ˚C
-
ESD LIMITING VALUE
SYMBOL
VC
PARAMETER
Electrostatic discharge capacitor
voltage, all pins
CONDITIONS
Human body model
(100 pF, 1.5 k)
THERMAL RESISTANCES
SYMBOL
Rth j-mb
Rth j-a
PARAMETER
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
CONDITIONS
-
Minimum footprint, FR4
board
MIN.
-
-
-
-
-
-
-
- 55
MAX.
55
55
20
49
35
160
110
175
UNIT
V
V
V
A
A
A
W
˚C
MIN.
-
MAX.
2
UNIT
kV
TYP.
-
50
MAX.
1.4
-
UNIT
K/W
K/W
February 1999
1
Rev 1.000

PagesPages 8
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