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PDF RF3315 Data sheet ( Hoja de datos )
| Número de pieza | RF3315 | |
| Descripción | ROADBAND HIGH LINEARITY AMPLIFIER | |
| Fabricantes | RF Micro Devices | |
| Logotipo |  |
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0
Pb-Free Product
Typical Applications
• Basestation Applications
• Cellular and PCS Systems
RF3315
BROADBAND HIGH LINEARITY AMPLIFIER
• WLL, W-CDMA Systems
• Final PA for Low-Power Applications
Product Description
The RF3315 is a high-efficiency GaAs Heterojunction
Bipolar Transistor (HBT) amplifier packaged in a low-cost
surface-mount package. This amplifier is ideal for use in
applications requiring high-linearity and low noise figure
over the 300MHz to 3GHz frequency range. The RF3315
operates from a single 5V power supply.
1.04 0.50
0.80 0.30
1.60
1.40
3.10
2.90
4.60
4.40
0.48
0.36
2 PL
2.60
2.40
Shaded lead is pin 1.
Dimensions in mm.
1.75
1.40
0.43
0.38
1.80
1.45
0.53
0.41
Optimum Technology Matching® Applied
Si BJT
9GaAs HBT
GaAs MESFET
Si Bi-CMOS
SiGe HBT
Si CMOS
InGaP/HBT
GaN HEMT
SiGe Bi-CMOS
4
Package Style: SOT89
Features
• 300MHz to 3GHz
• +40dBm Output IP3
• 12.5dB Gain at 2.0GHz
• +23dBm P1dB
• 3.0dB Typical Noise Figure at 2.0GHz
• Single 5V Power Supply
123
Functional Block Diagram
Ordering Information
RF3315
Broadband High Linearity Amplifier
RF3315PCBA-410 Fully Assembled Evaluation Board (2GHz)
RF3315PCBA-411 Fully Assembled Evaluation Board (900MHz)
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev A9 050310
4-557
1 page  
RF3315
Typical Application Schematic for 900MHz
4
123
100 pF
RF IN
4.7 pF
4.7 nH
100 nH
6 pF
8.7 nH
VCC
1 µF +
RF OUT
Evaluation Board Schematic for 900MHz
P1-1
P1
1 VCC
4
2 GND
C3
3 GND
123
100 pF
CON3
J1
C1
4.7 pF
L2
100 nH
C2
6 pF
RF IN
L1
L3
4.7 nH
8.7 nH
VCC
+ C4
1 µF
J2
RF OUT
Rev A9 050310
4-561
5 Page 
RF3315
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is
3µinch to 8µinch gold over 180µinch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
Pin 1
A = 1.27 x 0.86 (mm) Typ.
Dimensions in mm.
A
3.43
2.79 2.34
1.48 1.02
0.43
0.03
0.66 Typ.
1.88 Typ.
A
Figure 1. PCB Metal Land Pattern (Top View)
5.36
Rev A9 050310
4-567
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet RF3315.PDF ] | |
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