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Número de pieza | 74ABT126 | |
Descripción | Quad Buffer | |
Fabricantes | Fairchild Semiconductor | |
Logotipo | ||
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74ABT126
Quad Buffer with 3-STATE Outputs
Features
■ Non-inverting buffers
■ Output sink capability of 64mA, source capability of
32mA
■ Guaranteed latchup protection
■ High impedance glitch free bus loading during entire
power up and power down cycle
■ Nondestructive hot insertion capability
■ Disable time less than enable time to avoid bus
contention
General Description
The ABT126 contains four independent non-inverting
buffers with 3-STATE outputs.
Ordering Information
Order Number
74ABT126CSC
74ABT126CSJ
74ABT126CMTC
Package
Number
M14A
M14D
MTC14
Package Description
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"
Narrow
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Connection Diagram
Pin Description
Pin Names
An, Bn
On
Description
Inputs
Outputs
Function Table
Inputs
An Bn
HL
HH
LX
Output
On
L
H
Z
H = HIGH Voltage Level
L = LOW Voltage Level
Z = HIGH Impedance
X = Immaterial
©1995 Fairchild Semiconductor Corporation
74ABT126 Rev. 1.4.0
www.fairchildsemi.com
1 page Physical Dimensions
8.75
8.50
7.62
14
6.00
A
8
B
4.00
3.80
0.65
5.60
PIN ONE
INDICATOR
1
1.27
(0.33)
7
0.51
0.35
1.70 1.27
LAND PATTERN RECOMMENDATION
0.25 M C B A
1.75 MAX
1.50
1.25
R0.10
R0.10
8°
0°
SEE DETAIL A
0.25
0.10 C
0.10 C
0.25
0.19
NOTES: UNLESS OTHERWISE SPECIFIED
0.50
0.25
A) THIS PACKAGE CONFORMS TO JEDEC
X 45°
MS-012, VARIATION AB, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
GAGE PLANE FLASH OR BURRS.
D) LANDPATTERN STANDARD:
0.36
SOIC127P600X145-14M
E) DRAWING CONFORMS TO ASME Y14.5M-1994
F) DRAWING FILE NAME: M14AREV13
0.90
0.50
(1.04)
SEATING PLANE
DETAIL A
SCALE: 20:1
Figure 1. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1995 Fairchild Semiconductor Corporation
74ABT126 Rev. 1.4.0
5
www.fairchildsemi.com
5 Page |
Páginas | Total 9 Páginas | |
PDF Descargar | [ Datasheet 74ABT126.PDF ] |
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