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Philips - Low Power WLAN SiP

Numéro de référence BGW200
Description Low Power WLAN SiP
Fabricant Philips 
Logo Philips 





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BGW200 fiche technique
BGW200 Low-power
WLAN SiP
Complete, single-package 802.11b
solution for mobile handheld devices
Optimized for low-power mobile applications, this complete,
single-package 802.11b solution combines a baseband/MAC,
RF transceiver, and power amplifier into an ultra-small
(150 mm2) package. It delivers the industry’s lowest power
consumption in standby mode and supports coexistence with
Bluetooth® solutions.
Semiconductors
The BGW200 is a complete, low-power 802.11b Wireless LAN (WLAN)
System-in-a-Package (SiP) solution optimized for battery-powered hand-
held devices. It enables consumers to connect to the growing number of
WLAN networks in offices, homes, and public places. It also allows service
providers to increase their network reach and customer base, enabling
complementary data and voice services across cellular/PCS and WLAN
networks. Coexistence support for Bluetooth 1.1 and 1.2 enables seamless
integration with Philips Bluetooth solutions.
Key features
Advanced, single-package WLAN SiP optimized for mobile handheld
devices
No RF-critical design required
Low total cost of ownership
Lowest power consumption in standby mode: < 2 mW (typ)
Ultra-small form factor
Low-profile 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm)
Only three external components for entire solution
“No Host Load” design delivers easy integration and longer battery life
Host processor sleeps while BGW200 processes beacons
BGW200 wakes the host processor only upon data packet arrival
Co-exists with Bluetooth 1.1 and 1.2
Complete software drivers, utility, and diagnostic tools
Applications
Smartphones, cellular phones,VoIP wireless phones
PDAs, handheld computing devices,WLAN adapter cards (Secure Digital)
Portable audio/video devices, MP3 players
Other handhelds and electronic devices for wireless digital, audio, multi-
media, and telephony
The SiP format, with its complete system functionality, delivers quicker
design cycles, lower risk, simplified manufacturing, and a reduced bill of
materials.The single-package format also simplifies assembly and testing,
and reduces yield losses.The SiP delivers a complete, fully tested imple-
mentation of 802.11b functionality, so development teams can focus their
energy on innovative product design instead of solving complex issues
related to RF layout.
Ultra-small footprint, ultra-low power consumption
The BGW200 uses a single, 68-pin HVQFN-like package that measures
only 10 x 15 x 1.3 mm.The entire 802.11b solution requires only three
external components and uses less than 180 mm2 of circuit board area.
The BGW200 incorporates several features that decreases power con-
sumption.There is an integrated ARM7 processor, 1.25 Mbytes of SRAM,
256 Kbytes of ROM, optimized host interfaces (SDIO/SPI), and integrated
power management hardware/software algorithms.The result is the lowest
standby power consumption in the industry (less than 2 mW).
Superior “No Host Load” Architecture
The BGW200 is designed to place no load on the host processor, so
mobile devices can integrate WLAN functionality without compromis-
ing application performance or battery life.The BGW200 only interfaces

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