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PDF MAX3669EHJ Data sheet ( Hoja de datos )
| Número de pieza | MAX3669EHJ | |
| Descripción | +3.3V / 622Mbps SDH/SONET Laser Driver with Current Monitors and APC | |
| Fabricantes | Maxim Integrated | |
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19-1575; Rev 0; 10/99
EVAALVUAAILTAIOBNLEKIT
+3.3V, 622Mbps SDH/SONET
Laser Driver with Current Monitors and APC
General Description
The MAX3669 is a complete, +3.3V laser driver with auto-
matic power control (APC) circuitry for SDH/SONET appli-
cations up to 622Mbps. It accepts differential PECL
inputs, provides bias and modulation currents, and oper-
ates over a temperature range from -40°C to +85°C.
An APC feedback loop is incorporated to maintain a
constant average optical power over temperature and
lifetime. The wide modulation current range from 5mA
to 75mA and bias current of 1mA to 80mA are easy to
program, making this product ideal for use in various
SDH/SONET applications. Two pins are provided to
monitor the current levels in the laser: BIASMON with
current proportional to laser bias current, and MOD-
MON with current proportional to laser modulation.
The MAX3669 also provides enable control and a failure-
monitor output to indicate when the APC loop is unable to
maintain the average optical power. The MAX3669 is
available in a 5mm 32-pin TQFP package as well as in
dice.
Applications
622Mbps SDH/SONET Access Nodes
Laser Driver Transmitters
Section Regenerators
+3.3V
Features
o +3.3V or +5.0V Single-Supply Operation
o 40mA Supply Current at +3.3V
o Programmable Bias Current from 1mA to 80mA
o Programmable Modulation Current from
5mA to 75mA
o Bias Current and Modulation Current Monitors
o 200ps Rise/Fall Time
o Automatic Average Power Control with Failure
Monitor
o Complies with ANSI, ITU, and Bellcore
SONET/SDH Specifications
o Enable Control
Ordering Information
PART
MAX3669EHJ
MAX3669E/D
TEMP. RANGE
-40°C to +85°C
(Note A)
PIN-PACKAGE
32 TQFP (5mm x 5mm)
Dice*
Note A: Dice are designed to operate over a -40°C to +140°C
junction temperature (Tj) range, but are tested and guaranteed
at TA = +25°C.
*Contact factory for availability.
Pin Configuration appears at end of data sheet.
Typical Application Circuit
+3.3V
124Ω
MAX3693
4:1
SERIALIZER
WITH
CLOCK GEN
PECL
84.5Ω
124Ω
DATA+
DATA-
84.5Ω
BIASMON
MODMON
+3.3V
MAX3669
VCC
OUT-
OUT+
0.1µF
BIAS
MD
LASER
R-
6.3Ω R+
20Ω
RD
5Ω
CD
1µF
RFILT
20Ω
CFILT
5pF
FERRITE
BEAD
CMD
1000pF
________________________________________________________________ Maxim Integrated Products 1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
1 page  
+3.3V, 622Mbps SDH/SONET
Laser Driver with Current Monitors and APC
Typical Operating Characteristics (continued)
(VCC = +3.3V, TA = +25°C, unless otherwise noted.)
DISTRIBUTION OF MODULATION CURRENT
STABILITY (WORST CASE)
35 TA = -40°C TO +85°C
30 IMOD = 5mA
25
20
15
10
5
0
-125 -25 75 175 275 375 475 575
MODULATION CURRENT STABILITY (ppm/°C)
DISTRIBUTION OF MONITOR DIODE CURRENT
STABILITY (WORST CASE)
25
TA = -40°C TO +85°C
IMD = 18µA
20
15
10
5
0
-500 -300 -100 100 300 500
MONITOR DIODE CURRENT STABILITY (ppm/°C)
RATIO OF IMOD vs. IMODMON
35
TA = +85°C
30
25 TA = +25°C
20 TA = -40°C
15
10
5
0
0 20 40 60
IMOD (mA)
80
RATIO OF IBIAS vs. IBIASMON
45
40 TA = +85°C
35
30 TA = +25°C
TA = -40°C
25
20
15
10
5
0
0 20 40 60
IBIAS (mA)
80
_______________________________________________________________________________________ 5
5 Page 
+3.3V, 622Mbps SDH/SONET
Laser Driver with Current Monitors and APC
At +5V power supply, the headroom voltage for the
MAX3669 is significantly improved. In this case, it is
possible to achieve a modulation current of more than
50mA (using resistor pull-ups as shown in the Typical
Operating Circuit). The MAX3669 can also be DC-coupled
to a laser diode when operating at +5V supply; the volt-
age at OUT+ should be ≥ 2.0V for proper operation.
Wire Bonding Die
For high current density and reliable operation, the
MAX3669 uses gold metalization. Make connections to
the die with gold wire only, using ball-bonding tech-
niques. Wedge bonding is not recommended. Die-pad
size is 4 mils (100µm) square, and die thickness is 12
mils (300µm) mils.
Layout Considerations
To minimize inductance, keep the connections between
the MAX3669 output pins and LD as close as possible.
Pin Configuration
Optimize the laser diode performance by placing a
bypass capacitor as close as possible to the laser
anode. Use good high-frequency layout techniques
and multilayer boards with uninterrupted ground planes
to minimize EMI and crosstalk.
Laser Safety and IEC 825
Using the MAX3669 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections must
be considered. Customers must determine the level of
fault tolerance required by their application, recognizing
that Maxim products are not designed or authorized for
use as components in systems intended for surgical
implant into the body, for applications intended to sup-
port or sustain life, or for any other application where the
failure of a Maxim product could create a situation
where personal injury or death may occur.
Chip Topography
TOP VIEW
VCC 1
VCC 2
DATA+ 3
DATA- 4
GND 5
VCC 6
BIASMON 7
MODMON 8
32 31 30 29 28 27 26 25
MAX3669
24 VCC
23 MD
22 GND
21 GND
20 VCC
19 OUT-
18 OUT+
17 VCC
9 10 11 12 13 14 15 16
GND
ENABLE
N.C.
GND
N.C.
VCC
FAIL
GND
N.C.
N.C.
GND
VCC
BIAS
VCC
BIASMAX
MODSET
GND
APCSET
N.C. 0.083"
GND
N.C.
(2.10mm)
GND
N.C.
CAPC
VCC
GND
TQFP
0.070"
(1.78mm)
Chip Information
TRANSISTOR COUNT: 1525
SUBSTRATE CONNECTED TO GND
______________________________________________________________________________________ 11
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| PDF Descargar | [ Datasheet MAX3669EHJ.PDF ] | |
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| Número de pieza | Descripción | Fabricantes |
| MAX3669EHJ | +3.3V / 622Mbps SDH/SONET Laser Driver with Current Monitors and APC | Maxim Integrated |
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