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PDF MAX3658 Data sheet ( Hoja de datos )

Número de pieza MAX3658
Descripción 622Mbps / Low-Noise / High-Gain Transimpedance Preamplifier
Fabricantes Maxim Integrated 
Logotipo Maxim Integrated Logotipo



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No Preview Available ! MAX3658 Hoja de datos, Descripción, Manual

19-3015; Rev 1; 5/04
622Mbps, Low-Noise, High-Gain
Transimpedance Preamplifier
General Description
The MAX3658 is a transimpedance preamplifier for
receivers operating up to 622Mbps. Low noise, high
gain, and low power dissipation make it ideal for fiber
access and small form-factor transceivers.
The MAX3658 features 45nA input-referred noise, 18k
transimpedance gain, 580MHz bandwidth, and 2mAP-P
input overload. Operating from a +3.3V supply, the
MAX3658 consumes only 66mW. An integrated filter
resistor provides positive bias for the photodiode. These
features, combined with a small die size, allow easy
assembly into a TO-46 header with a photodiode. The
MAX3658 also includes an average photocurrent monitor.
The MAX3658 has typical optical sensitivity of -33dBm
(0.9A/W), which exceeds the class-B APON require-
ments. Typical optical overload is 1dBm. The MAX3658
is available in die form with both output polarities
(MAX3658A and MAX3658B). The MAX3658A is also
available in a 3mm x 3mm 8-pin TDFN package.
Applications
Optical Receivers (Up to 622Mbps Operation)
Passive Optical Networks
SFF/SFP Transceivers
FTTx Transceivers
Features
45nARMS Noise, -33dBm Sensitivity
18.3kTransimpedance Gain
580MHz Bandwidth
2mAP-P Input Overload, 1dBm Overload
66mW Power Dissipation
3.3V Operation
Average Photocurrent Monitor
Ordering Information
PART
TEMP RANGE
PIN-
PACKAGE
PKG
CODE
MAX3658AETA
MAX3658AE/D
MAX3658BE/D
-40°C to +85°C
8 TDFN
(3mm x 3mm)
Dice*
Dice*
T833-1
*Dice are designed to operate over a -40°C to +100°C junction
temperature (Tj) range, but are tested and guaranteed at TA =
+25°C.
Pin Configuration appears at end of data sheet.
Typical Operating Circuit
+3.3V
CVCC1
CVCC2
CFILT
RFILT
FILT
IN
OUT+
OUT-
MAX3658
GND MON
5-PIN TO-46 HEADER
75*
75*
0.1µF
25*
0.1µF
COUT*
25*
MAX3748
100
LIMITING AMPLIFIER
RMON
*OPTIONAL COMPONENTS
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

1 page




MAX3658 pdf
622Mbps, Low-Noise, High-Gain
Transimpedance Preamplifier
Typical Operating Characteristics (continued)
(VCC = +3.3V, CIN = 0.5pF, TA = +25°C, unless otherwise noted.)
OUTPUT EYE DIAGRAM
(-28dBm OPTICAL INPUT)
MAX3658 toc13
231 - 1 PRBS INPUT AT 622Mbps
OUTPUT EYE DIAGRAM
(0dBm OPTICAL INPUT)
MAX3658 toc14
231 - 1 PRBS INPUT AT 622Mbps
4.5mV/div
20mV/div
300ps/div
200ps/div
Pin Description
PIN NAME
FUNCTION
1 VCC +3.3V Supply Voltage
2 IN Signal Input. Connect to photodiode anode.
Optional Filter Connection. Use to bias the photodiode cathode. An internal on-chip resistive network
3 FILT is connected between this pin and VCC; an external decoupling capacitor connected to this pin forms
a filter (see the Design Procedure section). Leave this pin open if a filter is not required.
4
MON
Optional Photocurrent Monitor. This is a current output. Connect a resistor between MON and ground
to monitor the average photocurrent. Leave this pin open if a monitor is not required.
5, 8
GND
Circuit Ground
6 OUT+ Positive 75Data Output. Increasing input current causes OUT+ to increase.
7
OUT-
Negative 75Data Output. Increasing input current causes OUT- to decrease.
_______________________________________________________________________________________ 5

5 Page





MAX3658 arduino
VCC
400
20k
FILT
20pF
Figure 7. FILT Interface
VCC
MON
622Mbps, Low-Noise, High-Gain
Transimpedance Preamplifier
Pad Coordinates
Table 2 gives center pad coordinates for the MAX3658
bond pads. Refer to application note HFAN-8.0.1:
Understanding Bonding Coordinates and Physical Die
Size for more information on bond-pad coordinates.
Table 2. Bond-Pad Information
PAD
BP1
BP2
BP3
BP4
BP5
BP6
BP7
BP8
BP9
BP10
NAME
MAX3658A MAX3658B
MON
MON
GND
GND
N.C.
N.C.
OUT+
OUT-
OUT-
OUT+
N.C.
N.C.
GND
GND
VCC
VCC
IN IN
FILT FILT
COORDINATES (µm)
XY
16.6 818.6
18.0 543.4
18.0 425.8
16.6 39.4
445.0
39.4
456.2
155.6
455.0
565.8
455.0
818.6
254.6
818.6
135.6
818.6
Figure 8. MON Interface
TOP VIEW
Pin Configuration
VCC 1
IN 2
FILT 3
MON 4
MAX3658
AGP**
8 GND
7 OUT-
6 OUT+
5 GND
Chip Information
TRANSISTOR COUNT: 833
PROCESS: GST-4
TDFN*
(3mm x 3mm)
*THE EXPOSED PAD MUST BE CONNECTED TO CIRCUIT BOARD
GROUND FOR PROPER THERMAL AND ELECTRICAL PERFORMANCE.
**AGP = DEVICE TOPMARK.
______________________________________________________________________________________ 11

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