CA3082 Datasheet PDF - Intersil
| Part Number | CA3082 | |
| Description | General Purpose High Current NPN Transistor Arrays | |
| Manufacturers | Intersil | |
| Logo |  |
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Data Sheet
General Purpose High Current NPN
Transistor Arrays
CA3081 and CA3082 consist of seven high current (to
100mA) silicon NPN transistors on a common monolithic
substrate. The CA3081 is connected in a common emitter
configuration and the CA3082 is connected in a common
collector configuration.
The CA3081 and CA3082 are capable of directly driving
seven segment displays, and light emitting diode (LED)
displays. These types are also well suited for a variety of
other drive applications, including relay control and thyristor
firing.
Ordering Information
PART NUMBER
(BRAND)
CA3081
CA3081F
TEMP.
RANGE (oC)
PACKAGE
-55 to 125 16 Ld PDIP
-55 to 125 16 Ld CERDIP
PKG.
NO.
E16.3
F16.3
CA3081M
(3081)
CA3082
CA3082M
(3082)
CA3082M96
(3082)
-55 to 125 16 Ld SOIC
M16.15
-55 to 125 16 Ld PDIP
-55 to 125 16 Ld SOIC
E16.3
M16.15
-55 to 125 16 Ld SOIC Tape M16.15
and Reel
CA3081, CA3082
November 1999
File Number 480.5
Features
• CA3081 - Common Emitter Array
• CA3082 - Common Collector Array
• Directly Drive Seven Segment Incandescent Displays and
Light Emitting Diode (LED) Display
• 7 Transistors Permit a Wide Range of Applications in
Either a Common Emitter (CA3081) or Common Collector
(CA3082) Configuration
• High IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA (Max)
• Low VCESAT (at 50mA) . . . . . . . . . . . . . . . . . . 0.4V (Typ)
Applications
• Drivers for
- Incandescent Display Devices
- LED Displays
• Relay Control
• Thyristor Firing
Pinouts
CA3081
COMMON EMITTER CONFIGURATION
(PDIP, CERDIP, SOIC)
TOP VIEW
1
2
3
4
SUBSTRATE 5
6
7
8
16
15
14
13
12
11
10
9
CA3082
COMMON COLLECTOR CONFIGURATION
(PDIP, SOIC)
TOP VIEW
1
2
3
4
SUBSTRATE 5
6
7
8
16
15
14
13
12
11
10
9
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
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CA3081, CA3082
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
E
-B-
H
0.25(0.010) M B M
123
-A-
D
SEATING PLANE
A
L
h x 45o
-C-
e A1
B
0.25(0.010) M C A M B S
α
0.10(0.004)
C
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A
0.0532 0.0688 1.35
1.75
-
A1
0.0040 0.0098 0.10
0.25
-
B 0.013 0.020 0.33 0.51 9
C
0.0075 0.0098 0.19
0.25
-
D 0.3859 0.3937 9.80 10.00 3
E
0.1497 0.1574 3.80
4.00
4
e 0.050 BSC
1.27 BSC
-
H
0.2284 0.2440 5.80
6.20
-
h
0.0099 0.0196 0.25
0.50
5
L 0.016 0.050 0.40 1.27 6
N 16
16 7
α 0o 8o 0o 8o -
Rev. 0 12/93
5
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| Information | Total 6 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ CA3082.PDF Datasheet ] | |
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