DIP24 Datasheet PDF - STMicroelectronics
| Part Number | DIP24 | |
| Description | Thermal Data | |
| Manufacturers | STMicroelectronics | |
| Logo |  |
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There is a preview and DIP24 download ( pdf file ) link at the bottom of this page. Total 2 Pages | ||
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® Thermal Data
DIP 24
24 leads
PACKAGE MATERIAL LIST
item #
leadframe
die attach
molding
compound
material
copper
epoxy glue
( silver filler )
epoxy resin
thickness
0.25 mm
10-40 µm
thermal
conductivity
2.61 W/cm°C
0.01 W/cm°C
3 mm
0.0063W/cm°C
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Zth(j-a) vs time width and die size
February 1998
1/2
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for DIP24 electronic component. |
| Information | Total 2 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ DIP24.PDF Datasheet ] | |
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