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Numéro de référence | DIP20 | ||
Description | Thermal Data | ||
Fabricant | ETC | ||
Logo | |||
1 Page
® Thermal Data
DIP 20
20 leads
PACKAGE MATERIAL LIST
item #
leadframe
die attach
molding
compound
material
copper
epoxy glue
( silver glue )
epoxy resin
thickness
0.25 mm
10-40 µm
thermal
conductivity
2.61 W/cm°C
0.01 W/cm°C
3 mm
0.0063W/cm°C
Typical assembly configuration before molding :
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Zth(j-a) vs time width and die size
February 1998
1/2
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Pages | Pages 2 | ||
Télécharger | [ DIP20 ] |
No | Description détaillée | Fabricant |
DIP20 | Thermal Data | ETC |
DIP24 | Thermal Data | STMicroelectronics |
DIP24-1A72-11 | (DIP Series) Molded DIP Reed Relays | MEDER |
DIP24-1Axx-xx | (DIP Series) Molded DIP Reed Relays | MEDER |
US18650VTC5A | Lithium-Ion Battery | Sony |
TSPC106 | PCI Bus Bridge Memory Controller | ATMEL |
TP9380 | NPN SILICON RF POWER TRANSISTOR | Advanced Semiconductor |
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