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PC28F160C3 fiches techniques PDF

Intel - Advanced Boot Block Flash Memory

Numéro de référence PC28F160C3
Description Advanced Boot Block Flash Memory
Fabricant Intel 
Logo Intel 





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PC28F160C3 fiche technique
Intel® Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)
Datasheet
Product Features
Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
— 12 V for fast production programming
1.65 V to 2.5 V or 2.7 V to 3.6 V I/O
Option
— Reduces overall system power
High Performance
— 2.7 V– 3.6 V: 70 ns max access time
Optimized Architecture for Code Plus
Data Storage
— Eight 4 Kword blocks, top or bottom
parameter boot
— Up to 127 x 32 Kword blocks
— Fast program suspend capability
— Fast erase suspend capability
Flexible Block Locking
— Lock/unlock any block
— Full protection on power-up
— Write Protect(WP#) pin for hardware
block protection
Low Power Consumption
— 9 mA typical read
— 7 uA typical standby with Automatic
Power Savings feature
Extended Temperature Operation
— -40 °C to +85 °C
128-bit Protection Register
— 64 bit unique device identifier
— 64 bit user programmable OTP cells
Extended Cycling Capability
— Minimum 100,000 block erase cycles
Software
— Intel® Flash Data Integrator
— Supports top or bottom boot storage,
streaming data (for example, voice)
— Intel Basic Command Set
— Common Flash Interface
Standard Surface Mount Packaging
— 48-Ball µBGA*/VFBGA
— 64-Ball Easy BGA packages
— 48-TSOP package
ETOX™ VIII (0.13 µm) Flash
Technology
— 8, 16, 32 Mbit
ETOX™ VII (0.18 µm) Flash Technology
— 16, 32, 64 Mbit
ETOX™ VI (0.25 µm) Flash Technology
— 8, 16 and 32 Mbit
The Intel® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power
applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)
with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel® Flash Data Integrator (Intel® FDI)
software and you have a cost-effective, flexible, monolithic code plus data storage solution.
Intel® Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-
ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be
obtained from the Intel® Flash website: http://www.intel.com/design/flash.
Order Number: 290645, Revision: 022
January 2005

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