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PDF 74F413P-MQB Data sheet ( Hoja de datos )

Número de pieza 74F413P-MQB
Descripción 64 x 4 First-In First-Out Buffer Memory with Parallel I/O
Fabricantes National 
Logotipo National Logotipo



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January 1995
54F 74F413
64 x 4 First-In First-Out Buffer Memory with Parallel I O
General Description
The ’F413 is an expandable fall-through type high-speed
First-In First-Out (FIFO) buffer memory organized as 64
words by four bits The 4-bit input and output registers rec-
ord and transmit respectively asynchronous data in parallel
form Control pins on the input and output allow for hand-
shaking and expansion The 4-bit wide 62-bit deep fall-
through stack has self-contained control logic
Features
Y Separate input and output clocks
Y Parallel input and output
Y Expandable without external logic
Y 15 MHz data rate
Y Supply current 160 mA max
Y Available in SOIC (300 mil only)
Commercial
74F413PC
Military
54F413DM (Note 1)
Package
Number
N16E
J16A
Package Description
16-Lead (0 300 Wide) Molded Dual-In-Line
16-Lead Ceramic Dual-In-Line
Note 1 Military grade device with environmental and burn-in processing Use suffix e DMQB
Logic Symbol
Connection Diagram
Pin Assignment
for DIP
TL F 9541 – 1
TL F 9541 – 2
TRI-STATE is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation TL F 9541
RRD-B30M105 Printed in U S A

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74F413P-MQB pdf
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F 413 P C X
Temperature Range Family
74F e Commercial
54F e Military
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
Special Variations
QB e Military grade device with
environmental and burn-in
processing
Temperature Range
C e Commercial (0 C to a70 C)
M e Military (b55 C to a125 C)
Physical Dimensions inches (millimeters)
16-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J16A
5

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