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Numéro de référence | NTP75N03R | ||
Description | Power MOSFET 75 Amps / 25 Volts N-Channel D2PAK / TO-220 | ||
Fabricant | ON Semiconductor | ||
Logo | |||
1 Page
NTB75N03R, NTP75N03R
Power MOSFET
75 Amps, 25 Volts
N−Channel D2PAK, TO−220
Features
• Planar HD3e Process for Fast Switching Performance
• Low RDS(on) to Minimize Conduction Loss
• Low Ciss to Minimize Driver Loss
• Low Gate Charge
MAXIMUM RATINGS (TJ = 25°C Unless otherwise specified)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance − Junction−to−Case
Total Power Dissipation @ TC = 25°C
Drain Current
− Continuous @ TC = 25°C
− Single Pulse (tp = 10 ms)
Thermal Resistance − Junction−to−Ambient
(Note 1)
Total Power Dissipation @ TA = 25°C
Drain Current − Continuous @ TA = 25°C
Thermal Resistance − Junction−to−Ambient
(Note 2)
Total Power Dissipation @ TA = 25°C
Drain Current − Continuous @ TA = 25°C
Operating and Storage Temperature Range
VDSS
VGS
RqJC
PD
ID
IDM
RqJA
PD
ID
RqJA
PD
ID
TJ, Tstg
25
±20
1.68
74.4
Vdc
Vdc
°C/W
W
75 A
225 A
60 °C/W
2.08 W
12.6 A
100 °C/W
1.25
9.7
−55 to
150
W
A
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 30 Vdc, VGS = 10 Vdc, IL = 12 Apk,
L = 1 mH, RG = 25 W)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 Seconds
EAS 71.7 mJ
TL 260 °C
1. When surface mounted to an FR4 board using 1 inch pad size,
(Cu Area 1.127 in2).
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 in2).
http://onsemi.com
75 AMPERES
25 VOLTS
RDS(on) = 5.6 mΩ (Typ)
4
4
12
3
1
2
3
TO−220AB
CASE 221A
STYLE 5
D2PAK
CASE 418AA
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
P75N03R
YWW
1
Gate
3
Source
1
Gate
75N03R
YWW
23
Drain Source
2
Drain
75N03
Y
WW
= Device Code
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping†
NTP75N03R
NTB75N03R
NTB75N03RT4
TO−220AB
D2PAK
D2PAK
50 Units/Rail
50 Units/Rail
800/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2003
October, 2003 − Rev. 2
1
Publication Order Number:
NTB75N03R/D
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Pages | Pages 8 | ||
Télécharger | [ NTP75N03R ] |
No | Description détaillée | Fabricant |
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