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NBSG16MMNR2 fiches techniques PDF

ON - 2.5V/3.3VMultilevel Input to CML Clock/Data Receiver/Driver/Translator Buffer

Numéro de référence NBSG16MMNR2
Description 2.5V/3.3VMultilevel Input to CML Clock/Data Receiver/Driver/Translator Buffer
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NBSG16MMNR2 fiche technique
NBSG16M
2.5V/3.3V Multilevel Input
to CML Clock/Data
Receiver/Driver/Translator
Buffer
The NBSG16M is a differential current mode logic (CML)
receiver/driver/translator buffer. The device is functionally equivalent
to the EP16, LVEP16, or SG16 devices with CML output structure and
lower EMI capabilities.
Inputs incorporate internal 50 W termination resistors and accept
LVNECL (Negative ECL), LVPECL (Positive ECL), LVTTL,
LVCMOS, CML, or LVDS. The CML output structure contains
internal 50 W source termination resistor to VCC. The device
generates 400 mV output amplitude with 50 W receiver resistor to
VCC.
The VBB pin is internally generated voltage supply available to this
device only. For all single−ended input conditions, the unused
complementary differential input is connected to VBB as a switching
reference voltage. VBB may also rebias AC coupled inputs. When
used, decouple VBB via a 0.01 mF capacitor and limit current sourcing
or sinking to 0.5 mA. When not used, VBB output should be left open.
Maximum Input Clock Frequency > 10 GHz Typical
Maximum Input Data Rate > 10 Gb/s Typical
120 ps Typical Propagation Delay
35 ps Typical Rise and Fall Times
Positive CML Output with Operating Range: VCC = 2.375 V to
3.465 V with VEE = 0 V
Negative CML Output with RSNECL or NECL Inputs with
Operating Range: VCC = 0 V with VEE = −2.375 V to −3.465 V
CML Output Level; 400 mV Peak−to−Peak Output with
50 W Receiver Resistor to VCC
50 W Internal Input and Output Termination Resistors
Compatible with Existing 2.5 V/3.3 V LVEP, EP, LVEL
and SG Devices
VBB Reference Voltage Output
http://onsemi.com
MARKING
DIAGRAM*
QFN−16
MN SUFFIX
CASE 485G
SG
16M
ALYW
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
Device
Package
Shipping
NBSG16MMN
3x3 mm
QFN−16
123 Units / Rail
NBSG16MMNR2
3x3 mm 3000/Tape & Reel
QFN−16
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
April, 2004 − Rev. 3
1
Publication Order Number:
NBSG16M/D

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