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NTE - Phototransistor Detector

Numéro de référence NTE3034A
Description Phototransistor Detector
Fabricant NTE 
Logo NTE 





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NTE3034A fiche technique
NTE3034A
Phototransistor Detector
Description:
The NTE3034A is designed for industrial processing and control applications such as light modula-
tors, shaft or position encoders, and end tape detectors. The NTE3034A is designed to be used with
the NTE3029A infrared emitter in optical slotted coupler/interrupter applications.
Features:
D Economical, Miniature Plastic Package
D Package Designed for Accurate Positioning
D Lens Molded into Package
Absolute Maximum Ratings:
Collector–Emitter Voltage, VCEO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V
Total Device Dissipation (TA = +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150mW
Derate Above 25°C (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2mW/°C
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40° to +100°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40° to +100°C
Lead Temperature (During Soldering, 1/16” from case, 5sec max., Note 2), TL . . . . . . . . . . +260°C
Electrical Characteristics: (TA = +25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Collector Dark Current
ID VCE = 10V, H [ 0
Collector–Emitter Breakdown Voltage V(BR)CEO IC = 10mA, H [ 0
Min Typ Max Unit
– – 100 nA
30 – – V
Optical Characteristics: (TA = +25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min Typ Max Unit
Collector Light Current
IL VCE = 5V, H = 500µW/cm2
100 500 – µA
Turn–On Time
Turn–Off Time
Saturation Voltage
ton H = 5mW/cm2, VCC = 5V,
toff RL = 2400
– 60 – µs
– 0.25 0.4 µs
VCE(sat) H = 5mW/cm2, IC = 2mA, VCC = 5V – 0.25 0.4 V
Wavelength of Maximum Sensitivity λs
– 0.8 – µm
Note 1. Measured with device soldered into a typical PC board.
Note 2. Heat sink should be applied to leads during soldering to prevent case temperature from ex-
ceeding +100°C.

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