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NTD32N06L Datasheet دیتاشیت PDF دانلود

دیتاشیت - ON - Power MOSFET 32 Amps / 60 Volts / Logic Level(N-Channel DPAK)

شماره قطعه NTD32N06L
شرح مفصل Power MOSFET 32 Amps / 60 Volts / Logic Level(N-Channel DPAK)
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NTD32N06L شرح
NTD32N06L
Power MOSFET
32 Amps, 60 Volts, Logic Level
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
Smaller Package than MTB30N06VL
Lower RDS(on), VDS(on), and Total Gate Charge
Lower and Tighter VSD
Lower Diode Reverse Recovery Time
Lower Reverse Recovery Stored Charge
http://onsemi.com
VDSS
60 V
RDS(ON) TYP
23.7 mW
N−Channel
D
ID MAX
32 A
Typical Applications
Power Supplies
Converters
Power Motor Controls
Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage (RGS = 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tpv10 ms)
Drain Current
− Continuous @ TA = 25°C
− Continuous @ TA = 100°C
− Single Pulse (tpv10 ms)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
Operating and Storage Temperature Range
VDSS
VDGR
VGS
VGS
60
60
"20
"30
Vdc
Vdc
Vdc
ID
ID
IDM
PD
TJ, Tstg
32 Adc
22
90 Apk
93.75
0.625
2.88
1.5
W
W/°C
W
W
−55 to °C
+175
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C (Note 3)
(VDD = 50 Vdc, VGS = 5 Vdc, L = 1.0 mH,
IL(pk) = 25 A, VDS = 60 Vdc, RG = 25 W)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8from case for 10 seconds
EAS 313 mJ
RqJC
RqJA
RqJA
TL
°C/W
1.6
52
100
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to FR4 board using 0.5pad size.
2. When surface mounted to FR4 board using minimum recommended pad
size.
3. Repetitive rating; pulse width limited by maximum junction temperature.
G
4
12
3
DPAK
CASE 369C
(Surface Mount)
Style 2
4
S
MARKING DIAGRAMS
4
Drain
1
Gate
2
Drain
3
Source
4
Drain
1
2
3
DPAK
CASE 369D
(Straight Lead)
Style 2
32N06L
Y
WW
Device Code
= Year
= Work Week
12 3
Gate Drain Source
ORDERING INFORMATION
Device
Package
Shipping
NTD32N06L
DPAK
75 Units/Rail
DPAK
NTD32N06L−1 Straight Lead
75 Units/Rail
NTD32N06LT4
DPAK
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
April, 2004 − Rev. 3
1
Publication Order Number:
NTD32N06L/D

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