M2S12D20TP-75L Datasheet PDF - Mitsubishi
| Part Number | M2S12D20TP-75L | |
| Description | 512M Double Data Rate Synchronous DRAM | |
| Manufacturers | Mitsubishi | |
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DDR SDRAM (Rev.1.1)
Feb.ME'0LITE2SCUTBRIISCHI
MITSUBISHI LSIs
M2S12D20/ 30TP -75, -75L, -10, -10L
512M Double Data Rate Synchronous DRAM
DESCRIPTION
M2S12D20TP is a 4-bank x 33,554,432-word x 4-bit,
M2S12D30TP is a 4-bank x 16,777,216-word x 8-bit,
double data rate synchronous DRAM, with SSTL_2 interface. All control and address signals are
referenced to the rising edge of CLK. Input data is registered on both edges of data strobes, and
output data and data strobe are referenced on both edges of CLK. The M2S12D20/30TP achieve
very high speed data rate up to 133MHz, and are suitable for main memory in computer systems.
FEATURES
- Vdd=Vddq=2.5V+0.2V
- Double data rate architecture; two data transfers per clock cycle
- Bidirectional, data strobe (DQS) is transmitted/received with data
- Differential clock inputs (CLK and /CLK)
- DLL aligns DQ and DQS transitions
- Commands are entered on each positive CLK edge;
- data and data mask are referenced to both edges of DQS
- 4 bank operations are controlled by BA0, BA1 (Bank Address)
- /CAS latency- 2.0/2.5 (programmable)
- Burst length- 2/4/8 (programmable)
- Burst type- sequential / interleave (programmable)
- Auto precharge / All bank precharge is controlled by A10
- 8192 refresh cycles /64ms (4 banks concurrent refresh)
- Auto refresh and Self refresh
- Row address A0-12 / Column address A0-9,11-12(x4)/ A0-9,11(x8)
SSTL_2 Interface
- 400-mil, 66-pin Thin Small Outline Package (TSOP II)
- JEDEC standard
- Low Power for the Self Refresh Current ICC6 :4mA (-75L,-10L)
Operating Frequencies
Speed Grade
-75 / -75L
-10 / -10L
Clock Rate
CL=2 *
CL=2.5 *
100MHz
133MHz
100MHz
125MHz
* CL = CAS(Read) Latency
Contents are subject to change without notice.
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.1)
Feb.ME'0LITE2SCUTBRIISCHI
MITSUBISHI LSIs
M2S12D20/ 30TP -75, -75L, -10, -10L
512M Double Data Rate Synchronous DRAM
BASIC FUNCTIONS
The M2S12D20/30TP provides basic functions, bank (row) activate, burst read / write, bank (row)
precharge, and auto / self refresh. Each command is defined by control signals of /RAS, /CAS and
/WE at CLK rising edge. In addition to 3 signals, /CS ,CKE and A10 are used as chip select,
refresh option, and precharge option, respectively. Refer to the command truth table for the
detailed definition of commands.
/CLK
CLK
/CS
Chip Select : L=select, H=deselect
/RAS
Command
/CAS
Command
define basic commands
/WE
Command
CKE
Refresh Option @refresh command
A10 Precharge Option @precharge or read/write command
Activate (ACT) [/RAS =L, /CAS =/WE =H]
ACT command activates one row in an idle bank indicated by BA.
Read (READ) [/RAS =H, /CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA. First output data appears after
/CAS latency. When A10 =H in this command, the bank is deactivated after the burst read (auto-
precharge, READA)
Write (WRITE) [/RAS =H, /CAS =/WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data length to be written
is defined by burst length. When A10 =H in this command, the bank is deactivated after the burst write
(auto-precharge, WRITEA)
Precharge (PRE) [/RAS =L, /CAS =H, /WE =L]
PRE command deactivates the active bank indicated by BA. This command also terminates burst read
/write operation. When A10 =H in this command, all banks are deactivated (precharge all, PREA ).
Auto-Refresh (REFA) [/RAS =/CAS =L, /WE =CKE =H]
REFA command starts auto-refresh cycle. Refresh addresses including bank address are generated
internally. After this command, the banks are precharged automatically.
MITSUBISHI ELECTRIC
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for M2S12D20TP-75L electronic component. |
| Information | Total 30 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ M2S12D20TP-75L.PDF Datasheet ] | |
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