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دیتاشیت - Fairchild Semiconductor - Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs

شماره قطعه 74LVTH374SJ
شرح مفصل Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
تولید کننده Fairchild Semiconductor 
آرم Fairchild Semiconductor 


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74LVTH374SJ شرح
September 1999
Revised October 1999
74LVT374 • 74LVTH374
Low Voltage Octal D-Type Flip-Flop
with 3-STATE Outputs
General Description
The LVT374 and LVTH374 are high-speed, low-power
octal D-type flip-flops featuring separate D-type inputs for
each flip-flop and 3-STATE outputs for bus-oriented appli-
cations. A buffered Clock (CP) and Output Enable (OE) are
common to all flip-flops.
The LVTH374 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
These octal flip-flops are designed for low-voltage (3.3V)
VCC applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT374 and LVTH374
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining low power dissipation.
Features
s Input and output interface capability to systems at
5V VCC
s Bus-Hold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH374),
also available without bushold feature (74LVT374).
s Live insertion/extraction permitted
s Power Up/Down high impedance provides glitch-free
bus loading
s Outputs source/sink 32 mA/+64 mA
s Functionally compatible with the 74 series 374
s Latch-up performance exceeds 500 mA
Ordering Code:
Order Number
74LVT374WM
74LVT374SJ
74LVT374MTC
74LVTH374WM
74LVTH374SJ
Package Number
Package Description
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH374MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbols
IEEE/IEC
© 1999 Fairchild Semiconductor Corporation DS012016
www.fairchildsemi.com

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