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PDF 74LVQ273 Data sheet ( Hoja de datos )
| Número de pieza | 74LVQ273 | |
| Descripción | Low Voltage Octal D-Type Flip-Flop | |
| Fabricantes | Fairchild Semiconductor | |
| Logotipo |  |
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April 1998
74LVQ273
Low Voltage Octal D-Type Flip-Flop
General Description
The LVQ273 has eight edge-triggered D-type flip-flops with
individual D inputs and Q outputs. The common buffered
Clock (CP) and Master Reset (MR) input load and reset
(clear) all flip-flops simultaneously.
The register is fully edge-triggered. The state of each D in-
put, one setup time before the LOW-to-HIGH clock transi-
tion, is transferred to the corresponding flip-flop’s Q output.
All outputs will be forced LOW independently of Clock or
Data inputs by a LOW voltage level on the MR input. The de-
vice is useful for applications where the true output only is re-
quired and the Clock and Master Reset are common to all
storage elements.
Features
n Ideal for low power/low noise 3.3V applications
n Implements patented EMI reduction circuitry
n Available in SOIC JEDEC, SOIC EIAJ and QSOP
packages
n Guaranteed simultaneous switching noise level and
dynamic threshold performance
n Improved latch-up immunity
n Guaranteed incident wave switching into 75Ω
n 4 kV minimum ESD immunity
Ordering Code:
Order Number
74LVQ273SC
74LVQ273SJ
74LVQ273QSC
Package Number
M20B
M20D
MQA20
Package Description
20-Lead (0.300" Wide) Molded Small Outline Package, SOIC JEDEC
20-Lead Shrink Molded Small Outline Package, SOIC EIAJ
20-Lead (0.150" Wide) Molded Shrink Small Outline Package, SSOP JEDEC
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Connection Diagram
Pin Assignment for
SOIC and QSOP
DS011358-1
IEEE/IEC
DS011358-2
DS011358-3
Pin Descriptions
Pin Names
D0– D7
MR
CP
Q0– Q7
Description
Data Inputs
Master Reset
Clock Pulse Input
Data Outputs
© 1998 Fairchild Semiconductor Corporation DS011358
www.fairchildsemi.com
1 page  
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead (0.300" Wide) Molded Small Outline Package, SOIC JEDEC
Package Number M20B
20-Lead Shrink Molded Small Outline Package, SOIC EIAJ
Package Number M20D
5
www.fairchildsemi.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet 74LVQ273.PDF ] | |
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