|
|
PDF 74LVCH32245AEC Data sheet ( Hoja de datos )
| Número de pieza | 74LVCH32245AEC | |
| Descripción | 32-bit bus transceiver with direction pin; 5 V tolerant; 3-state | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de 74LVCH32245AEC (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
|
No Preview Available !
INTEGRATED CIRCUITS
DATA SHEET
74LVC32245A; 74LVCH32245A
32-bit bus transceiver with direction
pin; 5 V tolerant; 3-state
Product specification
File under Integrated Circuits, IC24
1999 Sep 01
1 page  
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
1DIR
A3
1A0
A5
1A1
A6
1A2
B5
1A3
B6
C5 1A4
C6 1A5
D5 1A6
D6 1A7
1OE
A4
1B0
A2
1B1 A1
1B2
B2
1B3
B1
1B4 C2
1B5
C1
1B6
D2
1B7
D1
2DIR
H3
2A0
E5
2A1
E6
2A2
F5
2A3
F6
G5 2A4
G6 2A5
H6 2A6
H5 2A7
2OE
H4
2B0
E2
2B1 E1
2B2
F2
2B3
F1
2B4 G2
2B5
G1
2B6
H1
2B7
H2
3DIR
J3
3A0
J5
3A1
J6
3A2
K5
3A3
K6
L5 3A4
L6 3A5
M5 3A6
M6 3A7
3OE
J4
3B0
J2
3B1 J1
3B2
K2
3B3
K1
3B4 L2
3B5
L1
3B6
M2
3B7
M1
4DIR
T3
4A0
N5
4A1
N6
4A2
P5
4A3
P6
R5 4A4
R6 4A5
T6 4A6
T5 4A7
4OE
T4
4B0
N2
4B1 N1
4B2
P2
4B3
P1
4B4 R2
4B5
R1
4B6
T1
4B7
T2
MNA476
Fig.3 Logic symbol.
5 Page 
Philips Semiconductors
32-bit bus transceiver with direction pin;
5 V tolerant; 3-state
Product specification
74LVC32245A;
74LVCH32245A
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Sep 01
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet 74LVCH32245AEC.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| 74LVCH32245AEC | 32-bit bus transceiver with direction pin; 5 V tolerant; 3-state | NXP Semiconductors |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |