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PDF M29F200T Data sheet ( Hoja de datos )
| Número de pieza | M29F200T | |
| Descripción | 2 Mbit 256Kb x8 or 128Kb x16 / Boot Block Single Supply Flash Memory | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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M29F200T
M29F200B
2 Mbit (256Kb x8 or 128Kb x16, Boot Block)
Single Supply Flash Memory
5V±10% SUPPLY VOLTAGE for PROGRAM,
ERASE and READ OPERATIONS
FAST ACCESS TIME: 55ns
FAST PROGRAMMING TIME
– 10µs by Byte / 16µs by Word typical
PROGRAM/ERASE CONTROLLER (P/E.C.)
– Program Byte-by-Byte or Word-by-Word
– Status Register bits and Ready/Busy Output
MEMORY BLOCKS
– Boot Block (Top or Bottom location)
– Parameter and Main blocks
BLOCK, MULTI-BLOCK and CHIP ERASE
MULTI-BLOCK PROTECTION/TEMPORARY
UNPROTECTION MODES
ERASE SUSPEND and RESUME MODES
– Read and Program another Block during
Erase Suspend
LOW POWER CONSUMPTION
– Stand-by and Automatic Stand-by
100,000 PROGRAM/ERASE CYCLES per
BLOCK
20 YEARS DATA RETENTION
– Defectivity below 1ppm/year
ELECTRONIC SIGNATURE
– Manufacturer Code: 0020h
– Device Code, M29F200T: 00D3h
– Device Code, M29F200B: 00D4h
DESCRIPTION
The M29F200 is a non-volatile memory that may
be erased electrically at the block or chip level and
programmed in-system on a Byte-by-Byteor Word-
by-Word basis using only a single 5V VCC supply.
For Program and Erase operations the necessary
high voltages are generated internally. The device
can also be programmed in standard program-
mers.
The array matrix organisation allows each block to
be erased and reprogrammed without affecting
other blocks. Blocks can be protected against pro-
graming and erase on programming equipment,
and temporarily unprotected to make changes in
the application.
TSOP48 (N)
12 x 20 mm
44
1
SO44 (M)
Figure 1. Logic Diagram
VCC
17
A0-A16
15
DQ0-DQ14
W DQ15A–1
M29F200T
E M29F200B BYTE
G RB
RP
VSS
AI01986
July 1998
1/33
1 page  
M29F200T, M29F200B
Command Interface
Instructions, made up of commands written in cy-
cles, can be given to the Program/Erase Controller
through a Command Interface (C.I.). For added
data protection, program or erase execution starts
after 4 or 6 cycles. The first, second,fourth and fifth
cycles are used to input Coded cycles to the C.I.
This Coded sequence is the same for all Pro-
gram/Erase Controller instructions. The ’Com-
mand’ itself and its confirmation, when applicable,
are given on the third, fourth or sixth cycles. Any
incorrect command or any improper command se-
quence will reset the device to Read Array mode.
Instructions
Seven instructions are defined to perform Read
Array, Auto Select (to read the ElectronicSignature
or Block ProtectionStatus), Program, Block Erase,
Chip Erase, Erase Suspend and Erase Resume.
The internal P/E.C. automatically handles all tim-
ing and verification of the Program and Erase
operations.The Status Register Data Polling, Tog-
gle, Error bits and the RB output may be read at
any time, during programming or erase, to monitor
the progress of the operation.
Instructions are composed of up to six cycles. The
first two cycles input a Coded sequence to the
Command Interfacewhich iscommon to all instruc-
tions (see Table 8). The third cycle inputs the
instruction set-up command. Subsequent cycles
output the addressed data, Electronic Signature or
Block Protection Status for Read operations. In
order to give additional data protection,the instruc-
tions for Program and Block or Chip Erase require
further command inputs. For a Programinstruction,
the fourth command cycle inputs the address and
data to be programmed. For an Erase instruction
(Block or Chip), the fourth and fifth cycles input a
further Coded sequence before the Erase confirm
command on the sixth cycle. Erasure of a memory
block may be suspended,in orderto read data from
another block or to program data in another block,
and then resumed.
When power is first applied or if VCC falls below
VLKO, the command interface is reset to Read
Array.
SIGNAL DESCRIPTIONS
See Figure 1 and Table 1.
Address Inputs (A0-A16). The address inputs for
the memory array are latched during a write opera-
tion on the falling edge of Chip Enable E or Write
Enable W. In Word-wide organisation the address
lines are A0-A16, in Byte-wide organisation
DQ15A–1 acts as an additional LSB address line.
When A9 is raised to VID, either a Read Electronic
Signature Manufacturer or Device Code, Block
Protection Status or a Write Block Protection or
Block Unprotection is enabled depending on the
combination of levels on A0, A1, A6, A12 and A15.
Data Input/Outputs (DQ0-DQ7). T h e s e I n-
puts/Outputsare used in the Byte-wide and Word-
wide organisations. The input is data to be
programmed in the memory array or a command
to be written to the C.I. Both are latched on the
rising edge of Chip Enable E or Write Enable W.
The output is data from the Memory Array, the
Electronic Signature Manufacturer or Device
codes, the Block Protection Status or the Status
register Data Polling bit DQ7, the Toggle Bits DQ6
and DQ2, the Error bit DQ5 or the Erase Timer bit
DQ3. Outputs are valid when Chip Enable E and
Output Enable G are active. The output is high
impedance when the chip is deselected or the
outputsare disabled and when RP is at a Low level.
Data Input/Outputs (DQ8-DQ14 and DQ15A–1).
These Inputs/Outputs are additionally used in the
Word-wide organisation.When BYTEis High DQ8-
DQ14 and DQ15A–1 act as the MSB of the Data
Input or Output, functioning as described for DQ0-
DQ7 above, and DQ8-DQ15 are ’don’t care’ for
command inputs or status outputs. When BYTE is
Low, DQ8-DQ14 are high impedance, DQ15A–1 is
the Address A–1 input.
Chip Enable (E). The Chip Enable input activates
the memory control logic, input buffers, decoders
and sense amplifiers. E High deselectsthe memory
and reduces the power consumptionto the standby
level. E can also be used to control writing to the
command register and to the memory array, while
W remains at a low level. The Chip Enable must be
forced to VID during the Block Unprotection opera-
tion.
Output Enable (G). The Output Enable gates the
outputs through the data buffers during a read
operation. When G is High the outputs are High
impedance. G must be forced to VID level during
Block Protection and Unprotection operations.
Write Enable (W). This input controls writing to the
Command Registerand Addressand Datalatches.
Byte/Word Organization Select (BYTE). The
BYTE input selects the output configuration for the
device: Byte-wide (x8) mode or Word-wide (x16)
mode. When BYTE is Low, the Byte-wide mode is
selected and the data is read and programmed on
DQ0-DQ7. In this mode, DQ8-DQ14 are at high
impedance and DQ15A–1 is the LSB address.
When BYTE is High, the Word-wide mode is se-
lected and the data is read and programmed on
DQ0-DQ15.
5/33
5 Page 
M29F200T, M29F200B
Table 10. Polling and Toggle Bits
Mode
DQ7 DQ6 DQ2
Program
DQ7 Toggle 1
Erase
Erase Suspend Read
(in Erase Suspend
block)
0 Toggle Note 1
1 1 Toggle
Erase Suspend Read
(outside Erase Suspend
block)
DQ7
DQ6
DQ2
Erase Suspend Program DQ7 Toggle N/A
Note: 1. Toggle if the address is within a block being erased.
’1’ if the address is within a block not being erased.
Toggle Bit (DQ2). This toggle bit, together with
DQ6, can be used to determine the device status
during the Erase operations. It can also be used to
identify the block being erased. During Erase or
Erase Suspend a read from a block being erased
will cause DQ2 to toggle. A read from a block not
being erased will set DQ2 to ’1’ during erase and
to DQ2 during Erase Suspend. During Chip Erase
a read operation will cause DQ2 to toggle as all
blocks are being erased. DQ2 will be set to ’1’
during program operation and when erase is com-
plete. After erase completion and if the error bit
DQ5 is set to ’1’, DQ2 will toggle if the faulty block
is addressed.
Error Bit (DQ5). This bit is set to ’1’ by the P/E.C.
when there is a failure of programming, block
erase, or chip erase that results in invalid data in
the memory block. In caseof an error in block erase
or program, the block in which the error occured or
to which the programmed data belongs, must be
discarded. The DQ5 failure condition will also ap-
pear if a user tries to program a ’1’ to a locationthat
is previously programmed to ’0’. Other Blocks may
stillbe used.The error bit resets after a Read/Reset
(RD) instruction. In case of success of Program or
Erase, the error bit will be set to ’0’ .
Erase Timer Bit (DQ3). This bit is set to ’0’ by the
P/E.C. when the last block Erase command has
been entered to the Command Interface and it is
awaiting the Erase start. When the erase timeout
period is finished, after 80µs to 120µs, DQ3 returns
to ’1’.
Coded Cycles
The two Coded cycles unlock the Command Inter-
face. They are followed by an input command or a
confirmation command. The Coded cycles consist
of writing the data AAh at address AAAAh in the
Byte-wide configuration and at address 5555h in
the Word-wide configuration during the first cycle.
During the second cycle the Coded cycles consist
of writing the data 55h at address 5555h in the
Byte-wide configuration and at address 2AAAh in
the Word-wide configuration. In the Byte-widecon-
figuration the address lines A–1 to A14 are valid, in
Word-wide A0 to A14 are valid, other address lines
are ’don’t care’. The Coded cycles happen on first
and second cycles of the command write or on the
fourth and fifth cycles.
Instructions
See Table 8.
Read/Reset (RD) Instruction. The Read/Reset
instruction consists of one write cycle giving the
command F0h. It can be optionally preceded by the
two Coded cycles. Subsequentread operationswill
read the memory array addressed and output the
data read. A wait state of 10µs is necessary after
Read/Reset prior to any valid read if the memory
was in an Erase mode when the RD instruction is
given.
Auto Select (AS) Instruction. This instruction
uses the two Coded cycles followed by one write
cycle giving the command 90h to address AAAAh
in the Byte-wide configuration or address 5555h in
the Word-wide configuration for command set-up.
A subsequent read will output the manufacturer
code and the device code or the block protection
status depending on the levels of A0 and A1. The
manufacturer code, 20h, is output when the ad-
dresses lines A0 and A1 are Low, the device code,
D3h for Top Boot, D4h for Bottom Boot is output
when A0 is High with A1 Low.
The AS instruction also allows access to the block
protectionstatus.After givingthe AS instruction, A0
is set to VIL with A1 at VIH, while A12-A16 define
the address of the block to be verified. A read in
these conditions will output a 01h if the block is
protected and a 00h if the block is not protected.
Program (PG) Instruction. This instruction uses
four write cycles. Both for Byte-wide configuration
and for Word-wide configuration. The Program
command A0h is written to address AAAAh in the
Byte-wide configuration or to address 5555h in the
Word-wide configurationon the third cycle after two
Coded cycles. A fourth write operation latches the
Address on the falling edge of W or E and the Data
to be written on the rising edge and starts the
P/E.C. Read operations output the Status Register
bits after the programming has started. Memory
programming is made only by writing ’0’ in place of
’1’. Status bits DQ6 and DQ7 determine if program-
ming is on-goingand DQ5 allows verification of any
possible error. Programming at an address not in
blocks being erased is also possible during erase
suspend. In this case, DQ2 will toggle at the ad-
dress being programmed.
11/33
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| PDF Descargar | [ Datasheet M29F200T.PDF ] | |
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