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Mitel Networks Corporation - Stand Alone FFT Processor

Numéro de référence PDSP16510AMAAC1R
Description Stand Alone FFT Processor
Fabricant Mitel Networks Corporation 
Logo Mitel Networks Corporation 





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PDSP16510AMAAC1R fiche technique
Supersedes January 1997 version, DS3762 - 2.0
PDSP16510A MA
PDSP16510A MA
Stand Alone FFT Processor
DS3762 - 3.0 October 1998
The PDSP16510 performs Forward or Inverse Fast
Fourier Transforms on complex or real data sets containing up
to 1024 points. Data and coefficients are each represented by
16 bits, with block floating point arithmetic for increased
dynamic range.
An internal RAM is provided which can hold up to 1024
complex data points. This removes the memory transfer
bottleneck, inherent in building block solutions. Its organisa-
tion allows the PDSP16510 to simultaneously input new data,
transform data stored in the RAM, and to output previous
results. No external buffering is needed for transforms con-
taining up to 256 points, and the PDSP16510 can be directly
connected to an A/D converter to perform continuous trans-
forms. The user can choose to overlap data blocks by either
0%, 50%, or 75%. Inputs and outputs are asynchronous to the
40MHz system clock used for internal operations.
A 1024 point complex transform can be completed in
some 98µs, which is equivalent to throughput rates of 450
million operations per second. Multiple devices can be con-
nected in parallel in order to increase the sampling rate up to
the 40MHz system clock. Six devices are needed to give the
maximum performance with 1024 point transforms.
Either a Hamming or a Blackman-Harris window operator
can be internally applied to the incoming real or complex data.
The latter gives 67dB side lobe attenuation. The operator
values are calculated internally and do not require an external
ROM nor do they incur any time penalty.
The device outputs the real and imaginary components of
the frequency bins. These can be directly connected to the
PDSP16330 in order to produce magnitude and phase values
from the complex data.
Rev
Date
AB C
MAR 1993 JAN 1997 OCT 1998
D
NOTE
Polyimide is used as an inter-layer dielectric and as
glassivation.
Polymeric material is also used for die attach which according
to the requirement in paragraph 1.2.1.b. (2) precludes
catagorising this device as fully compliant. In every other
respect this device has been manufactured and screened in
full accordance with the requirements of Mil-Std 883 (latest
revision).
CHANGE NOTIFICATION
The change notification requirements of MIL-PRF-38535 will
be implemented on this device type. Known customers will be
notified of any changes since the last buy when ordering
further parts if significant changes have been made.
Fig. 1. Block Diagram
FEATURES
Completely self contained FFT Processor
Internal RAM supports up to1024 complex points
16 bit data and coefficients plus block floating point for
increased dynamic range
450 MIP operation gives 98 microsecond transforma-
tion times for 1024 points
Up to 40MHz sampling rates with A grade multiple
devices.
Internal window operator gives 67dB side lobe
attenuation and needs no external ROM.
132 pin surface mount package
ORDERING INFORMATION
PDSP16510A MA GCPR (Power Ceramic QFP Package
- HIREL LEVEL A Screening)
PDSP16510A MA AC1R (Power Ceramic PGA Package
- HIREL LEVEL A Screening)
1

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