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PDF HYM72V8000GS-50- Data sheet ( Hoja de datos )

Número de pieza HYM72V8000GS-50-
Descripción 8M x 72-Bit Dynamic RAM Module
Fabricantes Siemens 
Logotipo Siemens Logotipo



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No Preview Available ! HYM72V8000GS-50- Hoja de datos, Descripción, Manual

8M × 72-Bit Dynamic RAM Module
(ECC - Module)
HYM 72V8000GS-50/-60
HYM 72V8010GS-50/-60
Preliminary Information
8 388 608 words by 72-bit ECC - mode, one bank organization
Fast access and cycle time
50 ns access time
90 ns cycle time (-50 version)
60 ns access time
110 ns cycle time (-60 version)
Fast page mode capability with
35 ns cycle time (-50 version)
40 ns cycle time (-60 version)
Single + 3.3V ± 0.3 V supply
Low power dissipation
max. 4536 mW active (-50 version)
max. 3888 mW active (-60 version)
CMOS – 108 mW standby
TTL – 180 mW standby
CAS-before-RAS refresh, RAS-only-refresh
9 decoupling capacitors mounted on substrate
All inputs, outputs and clock fully LVTTL & LVCMOS compatible
4 Byte interleave enabled, Dual Address inputs (A0/B0)
Buffered inputs excepts RAS and DQ
168 pin, dual read-out, Single in-Line Memory Module
Utilizes nine 8M × 8 -DRAMs and four BiCMOS 8-bit buffers/line drivers VT244A
Two versions: HYM 72V8010GS with SOJ-components ( 9 mm module thickness)
HYM 72V8000GS with TSOPII-components ( 4 mm module thickness)
4048 refresh cycles / 64 ms with 12 / 11 addressing
Gold contact pad
double sided module with 25.35 mm (1000 mil) height
Semiconductor Group
1
115.95

1 page




HYM72V8000GS-50- pdf
HYM72V8000/10GS-50/-60
8M x 72-ECC Module
Absolute Maximum Ratings
Operating temperature range ......................................................................................... 0 to + 70 °C
Storage temperature range...................................................................................... – 55 to + 125 °C
Input/output voltage ............................................................................... -0.5 to min (Vcc+0.5, 4.6) V
Power supply voltage................................................................................................. – 0.5V to 4.6 V
Power dissipation.................................................................................................................... 5,8 W
Data out current (short circuit) ................................................................................................ 50 mA
Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent
damage to the device. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
DC Characteristics
TA = 0 to 70 °C; VCC = 3.3 V ± 0.3 V
Parameter
Symbol
Input high voltage
VIH
Input low voltage
VIL
Output high voltage (LVTTL)
Output „H“ level voltage (IOUT = – 2 mA)
VOH
Output low voltage (LVTTL)
Output „L“ level voltage (IOUT = + 2 mA)
VOL
Output high voltage (LVCMOS)
Output „H“ level voltage (IOUT = – 100 µA)
VOH
Output low voltage (LVCMOS)
Output „L“ level voltage (IOUT = + 100 µA)
VOL
Input leakage current
(0 V < VIN < Vcc, all other pins = 0 V)
II(L)
Output leakage current
(DO is disabled, 0 V < VOUT < Vcc)
IO(L)
Average VCC supply current:
ICC1
-60 version
-70 version
Limit Values Unit
min.
max.
2.0 Vcc + 0.3 V
– 0.3
0.8
V
2.4 –
V
Test
Condition
1)
1)
1)
– 0.4 V 1)
Vcc-0.2 –
V 1)
– 0.2 V 1)
– 20 20
µA 1)
– 20 20
µA 1)
1260
mA 2) 3) 4)
1080
mA
(RAS, CAS, address cycling, tRC = tRC min.)
Standby VCC supply current
(RAS = CAS = VIH, one address change)
ICC2
50 mA –
Semiconductor Group
5

5 Page





HYM72V8000GS-50- arduino
L-DIM-168-4
Module package
(dual read-out, single in-line memory module)
133,35
HYM72V8000/10GS-50/-60
8M x 72-ECC Module
*)
1 10 11
85 95 96
40 41
127,35
124
125
84
168
Detail of Contacts
*) 4.00 max for modules assembled with TSOPII-packages
9.00 max for modules assembled with SOJ-packages
1.27
1.0 +/- 0.05
DM168-4.WMF
preliminary drawing
Semiconductor Group
11

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