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What is HYE25L256160AC?

This electronic component, produced by the manufacturer "Infineon", performs the same function as "256-Mbit Mobile-RAM".


HYE25L256160AC Datasheet PDF - Infineon

Part Number HYE25L256160AC
Description 256-Mbit Mobile-RAM
Manufacturers Infineon 
Logo Infineon Logo 


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Data Sheet, V1.1, April 2003
HYE25L256160AC
256-Mbit Mobile-RAM
Extended Temperature Range
Memory Products
Never stop thinking.

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HYE25L256160AC equivalent
HYE25L256160AC
256-Mbit Mobile-RAM
Overview
interleave fashion allows random access operation to occur at higher rate. A sequential and gapless data rate is
possible depending on burst length, CAS latency and speed grade of the device.
The Mobile-RAM is housed in a FBGA “chip-size” package. The Mobile-RAM is available in the extended (–25 °C
to +85 °C) temperature range.
Table 2 Ordering Information
Part Number1)
Function Code
HYE25L256160AC–7.5
PC133–333–522
HYE25L256160AC–8
PC100–222–620
Case Temperature Range
extended (–25 °C to +85 °C)
1) HYB/E: designator for memory components for commercial/extended temperature range
25L: Mobile-RAM at VDD = 2.5 V
256: 256-Mbit density
160: Product variation x16
A: Die revision A
C: Package type FBGA
7.5/8: speed grade - see Table 1
Package
P-TFBGA-54
Data Sheet
5 V1.1, 2003-04-16


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Part Details

On this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for HYE25L256160AC electronic component.


Information Total 30 Pages
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Featured Datasheets

Part NumberDescriptionMFRS
HYE25L256160ACThe function is 256-Mbit Mobile-RAM. InfineonInfineon
HYE25L256160AFThe function is 256MBit Mobile-RAM. InfineonInfineon

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