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PDF TDA7073 Data sheet ( Hoja de datos )
| Número de pieza | TDA7073 | |
| Descripción | Dual BTL power driver | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TDA7073A; TDA7073AT
Dual BTL power driver
Product specification
Supersedes data of 1994 July
File under Integrated Circuits, IC01
1999 Aug 30
1 page  
Philips Semiconductors
Dual BTL power driver
Product specification
TDA7073A; TDA7073AT
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
VP
IORM
IOSM
Ptot
positive supply voltage range
repetitive peak output current
non repetitive peak output current
total power dissipation
TDA7073A
TDA7073AT
Tstg storage temperature range
Tvj virtual junction temperature
Tsc short-circuit time
CONDITIONS
Tamb < 25 °C
Tamb < 25 °C
see note 1
MIN.
−
−
−
MAX. UNIT
18 V
1A
1.5 A
− 2.5 W
− 1.32 W
−55 +150 °C
− 150 °C
− 1 hr
Note
1. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth (j-a)
from junction to ambient
TDA7073A
TDA7073AT
CONDITIONS
in free air; note 1
in free air; note 2
VALUE
50
95
UNIT
K/W
K/W
Notes
1. TDA7073A: VP = 5 V; RL = 8 Ω; The typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO = 0.36 A and
Ptot = 2 × 0.76 W = 1.52 W; Tamb (max) = 150 − 1.52 × 50 = 74 °C.
2. TDA7073AT: VP = 5 V; RL = 16 Ω; typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO = 0.18 A and
Ptot = 2 × 0.38 W = 0.76 W; Tamb (max) = 150 − 0.76 × 95 = 77 °C.
1999 Aug 30
5
5 Page 
Philips Semiconductors
Dual BTL power driver
Product specification
TDA7073A; TDA7073AT
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Surface mount packages
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Aug 30
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet TDA7073.PDF ] | |
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