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PDF TDA4565 Data sheet ( Hoja de datos )
| Número de pieza | TDA4565 | |
| Descripción | Colour transient improvement circuit | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TDA4565
Colour transient improvement
circuit
Product specification
File under Integrated Circuits, IC02
November 1989
1 page  
Philips Semiconductors
Colour transient improvement circuit
Product specification
TDA4565
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
SYMBOL
Supply voltage range (pin 10)
Voltage ranges to pin 18 (ground)
at pins 1, 2, 12 and 15
at pin 11
at pin 17
Voltage ranges
at pin 7 to pin 6
at pin 8 to pin 9
Currents
at pins 6, 9
at pins 7, 8, 11 and 12
Total power dissipation
(Tj = 150 °C; Tamb = 70 °C)
Storage temperature range
Operating ambient temperature range
VP = V10-18
Vn-18
V11-18
V17-18
V7-6
V8-9
I6, 9
I7, 8, 11, 12
Ptot
Tstg
Tamb
MIN.
0
MAX.
13.2
0 VP
0 (Vp −3 V)
07
05
05
−10 +10
internally limited
− 1.1
−25 +150
0 +70
UNIT
V
V
V
V
V
V
mA
W
°C
°C
THERMAL RESISTANCE
From junction to ambient (in free air)
Note
1. Pins 3, 4, 5, 6, 9, 13 and 14 DC potential not published.
Rth j-a = 70 K/W
November 1989
5
5 Page 
Philips Semiconductors
Colour transient improvement circuit
Product specification
TDA4565
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 1989
11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TDA4565.PDF ] | |
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