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PDF TDA4557 Data sheet ( Hoja de datos )
| Número de pieza | TDA4557 | |
| Descripción | Multistandard decoder | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TDA4557
Multistandard decoder
Product specification
File under Integrated Circuits, IC02
March 1991
1 page  
Philips Semiconductors
Multistandard decoder
Product specification
TDA4557
CHARACTERISTICS
VP = V13-9 = 12 V; Tamb = 25 °C; measured in Fig.1; unless otherwise specified
PARAMETER
SYMBOL MIN.
TYP.
Supply (pin 13)
Supply voltage range
Supply current
Chrominance part
Chrominance input signal (pin 15)
input voltage with 75% colour bar signal
(peak-to-peak value)
input impedance
Chrominance output signal (pin 12)
output voltage
(peak-to-peak value)
output impedance
(npn emitter follower)
DC output voltage
Input for delayed signal (pin 10)
DC input current
input resistance
Demodulator part (PAL/NTSC)
Colour difference output signals
output voltage (proportional to V13-9)
(peak-to-peak value)
− (R-Y) signal (pin 1)
− (B-Y) signal (pin 3)
Ratio of colour difference output signals
(R-Y)/(B-Y)
Residual carrier (subcarrier frequency)
(peak-to-peak value)
Residual carrier (PAL only)
(peak-to-peak value)
H/2 ripple at (R-Y) output (pin 1)
(peak-to-peak value)
without input signal
DC output voltage
npn emitter follower with
internal current source of 0.3 mA
output impedance
VP
IP
V15(p-p)
Z15-9
V12(p-p)
Z12-9
V12-9
I10
R10-9
10.8
50
20
7
1.1
−
7.3
−
10
1.2
65
100
10
1.6
−
8.2
−
−
V1(p-p)
V3(p-p)
V1/3-9
V1,3(p-p)
V1,3(p-p)
V1(p-p)
V1,3-9
Z1,3-9
− 1.05 V ± 2 dB
− 1.33 V ± 2 dB
− 0.79 ± 10%
−−
− 10
−−
7.0 7.7
−−
MAX. UNIT
13.2 V
80 mA
400 mV
− kΩ
1.75 V
20 Ω
9.0 V
10 µA
− kΩ
−V
−V
−
30 mV
− mV
10 mV
8.4 V
150 Ω
March 1991
5
5 Page 
Philips Semiconductors
Multistandard decoder
Product specification
TDA4557
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 1991
11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TDA4557.PDF ] | |
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