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PDF TDA2653A Data sheet ( Hoja de datos )
| Número de pieza | TDA2653A | |
| Descripción | Vertical deflection circuit | |
| Fabricantes | NXP Semiconductors | |
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INTEGRATED CIRCUITS
DATA SHEET
TDA2653A
Vertical deflection circuit
Product specification
File under Integrated Circuits, IC02
January 1991
1 page  
Philips Semiconductors
Vertical deflection circuit
Product specification
TDA2653A
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
Supply voltage/output stage
Supply voltage
Output voltage
at −I6 = 1,1 A
at I6 = 1,1 A
Flyback generator output voltage at −I7 = 1,1 A
Peak output current
Flyback generator peak current
Feedback
V9-8 = VS
V6-8
V6-8
V7-8
±I6
±I7
9 to 30
V
≥ V5-8 − 2,2 V
typ. V5-8 − 1,9 V
typ. 1,3
V
≤ 1,6 V
typ. VS − 2,2 V
≤ 1,3 A
≤ 1,3 A
Input quiescent current
Synchronization
−I4; 10
typ. 0,1
µA
Sync input pulse
Tracking range
V2-8
1 to 12
V
typ. 28
%
Oscillator/sawtooth generator
Oscillator frequency control input voltage
Sawtooth generator output voltage
Sawtooth generator output current
V1-8
V3-8
V11-8
−I3
I11
6 to 9
V
0 to VS − 1 V
0 to VS − 2 V
0 to 4
mA
≥ −2
µA
≤ +30 mA
Oscillator temperature dependency
Tcase = 20 to 100 °C
Oscillator voltage dependency
VS = 10 to 30 V
Blanking pulse generator
(∆f/f)/∆Tcase typ. 10-4
K-1
(∆f/f)/∆VS
typ.
4 x 10-4
V-1
Output voltage
at VS = 24 V; I2 = 1 mA
Output current
Output resistance
Blanking pulse duration at 50 Hz sync
50 Hz/60 Hz switch capability
V2−8
−I2
R2−8
tb
typ. 18,5
V
≤3
mA
typ. 410
Ω
typ. 1,4 ± 0,07 ms
Saturation voltage; LOW voltage level
Output leakage current
Thermal resistance/junction temperature
V12−8
I12
typ. 1
typ. 1
V
µA
From junction to mounting base
Junction temperature; switching point thermal protection
Rth j-mb
Tj
≤5
K/W
typ.
150 ± 8
°C
January 1991
5
5 Page 
Philips Semiconductors
Vertical deflection circuit
Product specification
TDA2653A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
January 1991
11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TDA2653A.PDF ] | |
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