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PDF TCF6000 Data sheet ( Hoja de datos )
| Número de pieza | TCF6000 | |
| Descripción | PERIPHERAL CLAMPING ARRAY | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TCF6000 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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Peripheral Clamping Array
The TCF6000 was designed to protect input/output lines of
microprocessor systems against voltage transients.
• Optimized for HMOS System
• Minimal Component Count
• Low Board Space Requirement
• No P.C.B. Track Crossovers Required
• Applications Areas Include Automotive, Industrial,
Telecommunications and Consumer Goods
Order this document by TCF6000/D
TCF6000
PERIPHERAL CLAMPING
ARRAY
SEMICONDUCTOR
TECHNICAL DATA
8
1
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
NO SUFFIX
PLASTIC PACKAGE
CASE 626
Figure 1. Representative Block Diagram and
Simplified Application
VCC VDD
VRef
VRef
Generator
Pin Gnd
Gnd
Each Cell
Digital
Inputs
Analog
Inputs
Rin
Cin
Gnd
MOTOROLA ANALOG IC DEVICE DATA
Micro
Computer
PIN CONNECTIONS
Gnd 1
Clamp 2
Clamp 3
Clamp 4
8 VCC
7 Clamp
6 Clamp
5 Clamp
ORDERING INFORMATION
Device
Operating
Temperature Range
Package
TCF6000D TA = – 40° to +85°C
TCF6000
SO–8
Plastic DIP
© Motorola, Inc. 1996
Rev 0
1
1 page  
NOTE 2
85
14
F
–A–
–B–
TCF6000
OUTLINE DIMENSIONS
PLASTIC PACKAGE
CASE 626–05
ISSUE K
L
–T–
SEATING
PLANE
H
C
J
N
DK
M
G
0.13 (0.005) M T A M B M
–A–
8
1
5
–B– 4X P
4
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE N
0.25 (0.010) M B M
G
C
–T–
8X D
SEATING
K PLANE
0.25 (0.010) M T B S A S
R X 45 _
M_ J
F
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G 2.54 BSC
0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L 7.62 BSC
0.300 BSC
M ––– 10_ ––– 10_
N 0.76 1.01 0.030 0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.196
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC
0.050 BSC
J 0.18 0.25 0.007 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
MOTOROLA ANALOG IC DEVICE DATA
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet TCF6000.PDF ] | |
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