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Integrated Device Tech - 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO

Numéro de référence IDT72V253
Description 3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO
Fabricant Integrated Device Tech 
Logo Integrated Device Tech 





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IDT72V253 fiche technique
3.3 VOLT HIGH-DENSITY SUPERSYNC II™
NARROW BUS FIFO
512 x 18/1,024 x 9, 1,024 x 18/2,048 x 9
2,048 x 18/4,096 x 9, 4,096 x 18/8,192 x 9
8,192 x 18/16,384 x 9, 16,384 x 18/32,768 x 9
32,768 x 18/65,536 x 9, 65,536 x 18/131,072 x 9
IDT72V223, IDT72V233
IDT72V243, IDT72V253
IDT72V263, IDT72V273
IDT72V283, IDT72V293
FEATURES:
Choose among the following memory organizations:
IDT72V223 512 x 18/1,024 x 9
IDT72V233 1,024 x 18/2,048 x 9
IDT72V243 2,048 x 18/4,096 x 9
IDT72V253 4,096 x 18/8,192 x 9
IDT72V263 8,192 x 18/16,384 x 9
IDT72V273 16,384 x 18/32,768 x 9
IDT72V283 32,768 x 18/65,536 x 9
IDT72V293 65,536 x 18/131,072 x 9
Functionally compatible with the IDT72V255LA/72V265LA and
IDT72V275/72V285 SuperSync FIFOs
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (BGA Only)
User selectable input and output port bus-sizing
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out
Pin to Pin compatible to the higher density of IDT72V2103/72V2113
Big-Endian/Little-Endian user selectable byte representation
5V tolerant inputs
Fixed, low first word latency
Zero latency retransmit
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using EF and FF flags) or First Word
Fall Through timing (using OR and IR flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (BGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 80-pin Thin Quad Flat Pack (TQFP) or a 100-pin Ball
Grid Array (BGA) (with additional features)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
*Available on the
BGA package only.
*WEN WCLK/WR
D0 -Dn (x9 or x18)
LD SEN
INPUT REGISTER
OFFSET REGISTER
*ASYW
WRITE CONTROL
LOGIC
WRITE POINTER
RAM ARRAY
512 x 18 or 1,024 x 9
1,024 x 18 or 2,048 x 9
2,048 x 18 or 4,096 x 9
4,096 x 18 or 8,192 x 9
8,192 x 18 or 16,384 x 9
16,384 x 18 or 32,768 x 9
32,768 x 18 or 65,536 x 9
65,536 x 18 or 131,072 x 9
FLAG
LOGIC
READ POINTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
BE CONTROL
IP LOGIC
IW BUS
OW CONFIGURATION
OUTPUT REGISTER
READ
CONTROL
LOGIC
MRS
PRS
RESET
LOGIC
TCK
*TRST
* TMS
* TDI
**TDO
*
JTAG CONTROL
(BOUNDARY SCAN)
OE
Q0 -Qn (x9 or x18)
IDT and the IDT logo are a registered trademarks of Integrated Device Technology, Inc. The SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
RT
RM
*ASYR
*RCLK/RD
REN
4666 drw01
SEPTEMBER 2003
DSC-4666/12

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